Ethernet Over PDH Mapping Devices

Industry's First Carrier Ethernet Devices to Support Up to 16 T1/E1s or 8 DS3s with Over 400Mbps Throughput

Please check latest availability status for a specific part variant.


The DS33X162 family of semiconductor devices extend 10/100/1000Mbps Ethernet LAN segments by encapsulating MAC frames in GFP-F, HDLC, cHDLC, or X.86 (LAPS) for transmission over PDH/TDM data streams. The devices support the Ethernet over PDH (EoPDH) standards for the delivery of Ethernet Access Services, including eLAN, eLINE, and VLAN. The multiport devices support VCAT/LCAS for dynamic link aggregation. The serial links support bidirectional synchronous interconnect up to 52Mbps over xDSL, T1/E1/J1, T3/E3, or V.35/Optical.

The devices perform store-and-forward of frames with Ethernet traffic conditioning and bridging functions at wire speed. The programmability of classification, priority queuing, encapsulation, and bundling allows great flexibility in providing various Ethernet services. OAM flows can be extracted and inserted by an external processor to manage the Ethernet service.

The voice ports of the DS33W41 and DS33W11 easily connect to external codecs for integrated voice and data service applications.
DS33W11, DS33W41, DS33X11, DS33X161, DS33X162, DS33X41, DS33X42, DS33X81, DS33X82: Functional Diagram DS33W11, DS33W41, DS33X11, DS33X161, DS33X162, DS33X41, DS33X42, DS33X81, DS33X82: Functional Diagram Enlarge+

Key Features

  • 10/100/1000 IEEE 802.3 MAC (MII/RMII/GMII) with Autonegotiation and Flow Control
  • GFP-F/LAPS/HDLC/cHDLC Encapsulation
  • VCAT/LCAS Link Aggregation for Up to 16 Links
  • Supports Up to 200ms Differential Delay
  • Quality of Service (QoS) Support
  • VLAN, Q-in-Q, 802.1p, and DSCP Support
  • Ethernet Bridging and Filtering
  • Add/Drop OAM Frames from µP Interface
  • Traffic Shaping Through CIR/CBS Policing
  • External 256Mb, 125MHz DDR SDRAM Buffer
  • Parallel and SPI™ Microprocessor Interfaces
  • 1.8V, 2.5V, 3.3V Supplies
  • IEEE 1149.1 JTAG Support
Product Reliability Reports: DS33X41.pdf 
Device   Fab Process   Technology   Sample size   Rejects   FIT at 25°C   FIT at 55°C   Material Composition  

Note : The failure rates are summarized by technology and mapped to the associated material part numbers. The failure rates are highly dependent on the number of units tested.

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Type ID Title
Evaluation Board5814DS33X11DK Demo Kit for the DS33X11
Evaluation Board5727DS33X162DK Demo Kit for the DS33X162