DS3174DK

DS3/E3 Single-Chip Transceiver Demo Kit


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Description

The DS3174DK is an easy-to-use demo kit for the DS3174. A surface-mounted DS3174 and careful layout of the analog signal traces provide maximum signal integrity to demonstrate the transmit and receive capabilities of the DS3174. On-board Dallas 8051-compatible microcontroller and included software give point-and-click access to configuration and status registers from a personal computer. General-purpose LEDs on the board can easily be configured to indicate various alarm conditions for all four ports. The board provides eight BNC connectors for the line-side transmit and receive differential pairs, and two FPGAs to support overhead functions. All LEDs and connectors are clearly labeled with silkscreening to identify associated signals.

DEMO KIT CONTENTS

  • DS3174DK Board
  • CD-ROM
    • ChipView Software
    • DS3174 Definition Files
    • DS3174DK Data Sheet
    • DS3174 Data Sheet

Key Features

  • Soldered DS3174 for Best Signal Integrity
  • BNC Connectors, Transformers, and Termination Passives for All Four LIUs
  • Careful Layout for Analog Signal Paths
  • On-Board DS3, E3, and STS-1 Crystal Oscillators
  • DS3174 Configured for CPU Bus Operation for Complete Control Over the Device
  • On-Board Dallas Microcontroller and Included Software Provide Point-and-Click Access to the DS3174 Register Set
  • General-Purpose LEDs can be Configured for Various Alarm Conditions
  • Banana Jack Connectors for VDD and GND Support Use of Lab Power Supplies
  • Separate DS3174 VDD to Allow IDD Measurements
  • Easy-to-Read Silkscreen Labels Identify the Signals Associated with All Connectors, Jumpers, and LEDs
  • Applications/Uses

    • Access Concentrators
    • Digital Cross Connect
    • Integrated Access Device (IAD)
    • Multiservice Access Platform (MSAP)
    • Multiservice Protocol Platform (MSPP)
    • PBXs
    • PDH Multiplexer/Demultiplexer
    • Routers and Switches
    • SONET/SDH ADM and Muxes
    • Test Equipment
    Request Reliability Report for: DS3174DK 
    Device   Fab Process   Technology   Sample size   Rejects   FIT at 25°C   FIT at 55°C   Material Composition  

    Note : The failure rates are summarized by technology and mapped to the associated material part numbers. The failure rates are highly dependent on the number of units tested.

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