DS3150

3.3V, DS3/E3/STS-1 Line Interface Unit

Industry's First Single-Port T3/E3 LIU with Fully Integrated Jitter Attenuator


Please check latest availability status for a specific part variant.

Description

The DS3150 performs all the functions necessary for interfacing at the physical layer to DS3, E3, and STS-1 lines. The receiver performs clock and data recovery, B3ZS/HDB3 decoding, and loss-of-signal monitoring. The transmitter encodes outgoing data and drives standards-compliant waveforms onto 75Ω coaxial cable. The jitter attenuator can be mapped into the receive path or the transmit path.
DS3150: Functional Diagram DS3150: Functional Diagram Enlarge+

Key Features

  • Integrated Transmitter, Receiver, and Jitter Attenuator for DS3, E3, and STS-1
  • Performs Receive Clock/Data Recovery and Transmit Waveshaping
  • Jitter Attenuator Can Be Placed in the Receive Path or the Transmit Path
  • AGC/Equalizer Block Handles from 0dB to 15dB of Cable Loss
  • Interfaces to 75Ω Coaxial Cable at Lengths Up to 380m (DS3), 440m (E3), or 360m (STS-1)
  • Interfaces Directly to a DSX Monitor Signal (20dB Flat Loss) Using Built-In Preamp
  • Built-In B3ZS and HDB3 Encoder/Decoder
  • Bipolar and NRZ Interfaces
  • Local and Remote Loopbacks
  • On-Board 215 - 1 and 223 - 1 Pseudorandom Bit Sequence (PRBS) Generator and Detector
  • Line Build-Out (LBO) Control
  • Transmit Line-Driver Monitor Checks for a Faulty Transmitter or a Shorted Output
  • Complete DS3 AIS Generator (ANSI T1.107)
  • Unframed All-Ones Generator (E3 AIS)
  • Clock Inversion for Glueless Interfacing
  • Tri-State Line Driver for Low-Power Mode and Protection Switching Applications
  • Loss-of-Signal (LOS) Detector (ANSI T1.231 and ITU G.775)
  • Automatic Data Squelching During LOS
  • Requires Minimal External Components
  • Drop-In Replacement for TDK 78P2241/B and 78P7200L (Refer to Application Note 362)
  • Pin Compatible with TDK 78P7200
  • 3.3V Operation (5V Tolerant I/O), 110mA (max)
  • Industrial Temperature Range: -40°C to +85°C
  • Small Packaging: 28-Pin PLCC and 48-Pin TQFP

Applications/Uses

  • Access Concentrators
  • ATM and Frame Relay Equipment
  • CSUs/DSUs
  • Digital Cross-Connects
  • DSLAMs
  • PBXs
  • Routers
  • SONET/SDH and PDH Multiplexers

CAD Symbols and Footprints

  • DS3150Q
  • DS3150Q+
  • DS3150Q+T&R
  • DS3150QC1+
  • DS3150QN
  • DS3150QN+
  • DS3150QNC1
  • DS3150QNC1+
  • DS3150QNC1+T&R
  • DS3150QNC1/T&R
  • DS3150T
  • DS3150T+
  • DS3150TC1
  • DS3150TC1+
  • DS3150TN
  • DS3150TN+
  • DS3150TN1
  • DS3150TNC1
  • DS3150TNC1+
  • Device   Fab Process   Technology   Sample size   Rejects   FIT at 25°C   FIT at 55°C  

    Note : The failure rates are summarized by technology and mapped to the associated material part numbers. The failure rates are highly dependent on the number of units tested.

    Quality Management System >
    Environmental Management System >

     
    Status:
    Package:
    Temperature:

    Related Resources


    MAX5871
    16-Bit, 5.9Gsps Interpolating and Modulating RF DAC with JESD204B Interface

    • Simplifies RF Design and Enables New Wireless Communication Architectures
    • Direct RF Synthesis of 600MHz Bandwidth Up to 2.8GHz
    • Highly Flexible and Configurable



    Belle Isle 2020
    05/29/2020 - 05/31/2020, Detroit, MI
    2020 Detroit Grand Prix - Chevrolet Detroit Grand Prix presented by Lear Fast Facts The Chevrolet Detroit Grand Prix presented by Lear was hosted on Belle Isle, May 29 - 30 2020. The event featured the cars of the NTT IndyCar Series, the IMSA WeatherTech SportsCar Championship and the Trans Am Series presented by Pirelli. The weekend is collectively referred to as the Chevrolet Detroit Grand Prix presented by Lear and it once again featured the Chevrolet Dual in Detroit IndyCar doubleheader.

    RSVP