DS3148

6-/8-/12-Channel DS3/E3 Framers

Industry's Smallest, Lowest Cost T3/E3 Framers for Up to 12 Separate Channels


Please check latest availability status for a specific part variant.

Description

The DS3146/DS3148/DS31412 (DS314x) devices include all necessary circuitry to frame and format up to 12 separate DS3 or E3 channels. Each framer in these devices is independently configurable to support M23 DS3, C-Bit Parity DS3, or G.751 E3. The framers interface to a variety of line interface units (LIUs), microprocessor buses, and other system components without glue logic. Each DS3/E3 framer has its own HDLC controller, FEAC controller, and BERT, as well as full support for error detection and generation, performance monitoring, and loopbacks.
DS31412, DS3146, DS3148: Functional Diagram DS31412, DS3146, DS3148: Functional Diagram Enlarge+

Key Features

  • 6/8/12 Independent DS3/E3 Framers on a Single Die
  • Framing and Formatting to M23 DS3, C-Bit Parity DS3, and G.751 E3
  • LIU Interface can be Binary (NRZ) or Dual-Rail (POS/NEG)
  • B3ZS/HDB3 Encoder and Decoder
  • Generate and Detect DS3/E3 Alarms
  • Integrated HDLC Controller for Each Channel
  • Integrated FEAC Controller for Each Channel
  • Integrated Bit Error-Rate Tester (BERT) for Each Channel
  • Large Performance-Monitoring Counters
  • Line, Diagnostic, and Payload Loopbacks
  • Externally Controlled Transmit Overhead Insertion Port
  • Support External Timing or Loop-Timing
  • Framers can be Powered Down When Not Used
  • 8-Bit Processor Port Supports Muxed or Nonmuxed Bus Operation (Intel or Motorola)
  • 3.3V Supply with 5V Tolerant I/O
  • 349-Pin, 27mm x 27mm BGA Package
  • IEEE 1149.1 JTAG Support

Applications/Uses

  • Access Concentrators
  • ATM and Frame Relay Equipment
  • Digital Cross-Connects
  • PDH Muxes
  • Routers/Switches
  • SONET/SDH Muxes

Technical Documents

App Note 3111 Interfacing the DS3144 Framer with the DS3154 Line Interface Unit (LIU)

Quality and Environmental Data

Product Reliability Reports: DS3148.pdf 
Lead-Free Package Tin (Sn) Whisker Reports

Additional Resources

Demo Kit: DS3144DK
Driver Code

Tools & Models

  • DS3148 BSDL Model
  • Device   Fab Process   Technology   Sample size   Rejects   FIT at 25°C   FIT at 55°C  

    Note : The failure rates are summarized by technology and mapped to the associated material part numbers. The failure rates are highly dependent on the number of units tested.

    Quality Management System >
    Environmental Management System >

     
    Status:
    Package:
    Temperature:

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