DS21Q552

Quad T1/E1 Transceiver (3.3V, 5.0V)


Please check latest availability status for a specific part variant.

Description

The quad T1 and E1 transceiver MCMs offer a high density packaging arrangement for the DS21352/DS21552 T1 single-chip transceivers and the DS21354/DS21554 E1 single-chip transceivers. Four silicon die of one of these devices is packaged in a multi-chip module (MCM) with the electrical connections as shown in Figure 1 in the data sheet. All of the functions available on the DS21352/DS21552 and DS21354/DS21554 are also available in the MCM packaged version however in order to minimize package size, some signals have been deleted. These differences are detailed in table 1 in the data sheet.

This data sheet describes the electrical connections and the mechanical dimensions only. Please see the DS21352/DS21552 and DS21354/DS21554 data sheets for full details on all of the features and the operating characteristics of the device.
DS21Q352, DS21Q354, DS21Q552, DS21Q554: Schematic DS21Q352, DS21Q354, DS21Q552, DS21Q554: Schematic Enlarge+

Key Features

  • Four completely independent T1 or E1 transceivers in one small 27mm x 27mm package
  • Each transceiver contains a short and long haul line interface plus a full featured framer with alarm detection/generation, elastic-stores, hardware based signaling support, per DS0 channel control and HDLC controller
  • Each multi-chip module (MCM) contains four die of
    • DS21352 (DS21Q352)
    • DS21552 (DS21Q552)
    • DS21354 (DS21Q354)
    • DS21554 (DS21Q554)
  • See the specific DS21352/DS21552 and DS21354/DS21554 data sheets for details on their feature set and operation
  • All four T1 or E1 transceivers can be concatenated into a single 8.192MHz backplane data stream
  • IEEE 1149.1 JTAG-Boundary Scan architecture
  • DS21Q352/DS21Q552 and DS21Q354/DS21Q554 are pin compatible to allow the same footprint to support T1 and E1 applications
  • 256-pin MCM BGA package (27mm X 27mm)
  • Low power 5V CMOS or low power 3.3V CMOS with 5V tolerant input and outputs
Device   Fab Process   Technology   Sample size   Rejects   FIT at 25°C   FIT at 55°C  

Note : The failure rates are summarized by technology and mapped to the associated material part numbers. The failure rates are highly dependent on the number of units tested.

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Related Resources


Belle Isle 2020
05/29/2020 - 05/31/2020, Detroit, MI
2020 Detroit Grand Prix - Chevrolet Detroit Grand Prix presented by Lear Fast Facts The Chevrolet Detroit Grand Prix presented by Lear was hosted on Belle Isle, May 29 - 30 2020. The event featured the cars of the NTT IndyCar Series, the IMSA WeatherTech SportsCar Championship and the Trans Am Series presented by Pirelli. The weekend is collectively referred to as the Chevrolet Detroit Grand Prix presented by Lear and it once again featured the Chevrolet Dual in Detroit IndyCar doubleheader.

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