PowerCap with Crystal

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The DS9034PCX PowerCap is designed to be a lithium power source for nonvolatile timekeeping RAMs in Dallas Semiconductor's directly surface-mountable PowerCap Module (PCM) package. After a PowerCap module board has been soldered in place and cleaned, the DS9034PCX PowerCap is placed on top of the PCM board to form a complete PowerCap module package. The PowerCap is keyed to prevent incorrect attachment.

The DS9034PCX can be easily removed by inserting a regular screwdriver into a detachment feature and prying gently outward and upward to release the PowerCap from the PowerCap module board.
DS9034PCX: Package Information DS9034PCX: Package Information Enlarge+

Key Features

  • Provides 10 Years of Battery Backup Power for Nonvolatile Timekeeping RAMs in the PowerCap Module Package (PCM)
  • Snaps Directly Onto Surface-Mounted PowerCap Module Boards
  • Detachment Feature Allows Easy Removal
  • Compatible with these 34-Pin PowerCap Module Boards:
    • DS1386P
    • DS1486P
    • DS1643P
    • DS1644P
    • DS1646P
    • DS1647P
    • DS1743P/WP
    • DS1251YP/WP
    • DS1248YP/WP
    • DS1244YP/WP
    • DS1553P/YP/WP
    • DS1554P/YP/WP
    • DS1556P/YP/WP
    • DS1557P/YP/WP
    • DS1744P/YP/WP
    • DS1746P/YP/WP
    • DS1747P/YP/WP

See parametric specs for Timekeeping & Real-Time Clocks (78)

Part NumberMemory TypeTime of Day AlarmsFunctionsPackage/PinsBudgetary
(See Notes)
DS9034PCX None0Snap-On Battery Backup
$5.59 @1k

Pricing Notes:
This pricing is BUDGETARY, for comparing similar parts. Prices are in U.S. dollars and subject to change. Quantity pricing may vary substantially and international prices may differ due to local duties, taxes, fees, and exchange rates. For volume-specific and version-specific prices and delivery, please see the price and availability page or contact an authorized distributor.
Product Reliability Reports: DS9034PCX.pdf 
Device   Fab Process   Technology   Sample size   Rejects   FIT at 25°C   FIT at 55°C   Material Composition  

Note : The failure rates are summarized by technology and mapped to the associated material part numbers. The failure rates are highly dependent on the number of units tested.

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