DS1642

Nonvolatile Timekeeping RAM


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Description

The DS1642 is a 2k x 8 nonvolatile static RAM and a full-function real-time clock (RTC), both of which are accessible in a bytewide format. The nonvolatile time keeping RAM is pin and function equivalent to any JEDEC-standard 2k x 8 SRAM. The device can also be easily substituted in ROM, EPROM, and EEPROM sockets, providing read/write nonvolatility and the addition of the real-time clock function. The real-time clock information resides in the eight uppermost RAM locations. The RTC registers contain year, month, date, day, hours, minutes, and seconds data in 24-hour BCD format. Corrections for the day of the month and leap year are made automatically. The RTC clock registers are double-buffered to avoid access of incorrect data that can occur during clock update cycles. The double-buffered system also prevents time loss as the timekeeping countdown continues unabated by access to time register data. The DS1642 also contains its own power-fail circuitry, which deselects the device when the VCC supply is in an out-of-tolerance condition. This feature prevents loss of data from unpredictable system operation brought on by low VCC as errant access and update cycles are avoided.
DS1642: Block Diagram DS1642: Block Diagram Enlarge+

Key Features

  • Integrated NV SRAM, Real-Time Clock, Crystal, Power-Fail Control Circuit, and Lithium Energy Source
  • Standard JEDEC Bytewide 2k x 8 Static RAM Pinout
  • Clock Registers are Accessed Identically to the Static RAM. These Registers are Resident in the Eight Top RAM Locations
  • Totally Nonvolatile with Over 10 Years of Operation in the Absence of Power
  • Access Times of 85ns and 100ns
  • Quartz Accuracy ±1 Minute a Month at +25°C, Factory Calibrated
  • BCD-Coded Year, Month, Date, Day, Hours, Minutes, and Seconds with Leap Year Compensation Valid Up to 2100
  • Power-Fail Write Protection Allows for ±10% VCC Power Supply Tolerance
  • Lithium Energy Source is Electrically Disconnected to Retain Freshness Until Power is Applied for the First Time
Device   Fab Process   Technology   Sample size   Rejects   FIT at 25°C   FIT at 55°C  

Note : The failure rates are summarized by technology and mapped to the associated material part numbers. The failure rates are highly dependent on the number of units tested.

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