Evaluation Kit for the MAX30003 Biopotential AFE

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The MAX30003WING is an expansion board designed to help engineers and students alike to rapidly prototype ECG applications for wearables using the MAX30003 biopotential analog front end. The form factor is a small 0.9in by 2.0in dual-row header footprint that is compatible with breadboards and featherboards from Maxim and Adafruit®, as well as additional expansion boards called wings. Two grove connectors and a 6-pin Pmod™ connector are also included for additional connectivity to popular development boards offered by Seeed Studio® and Diligent®.

MAX30003WING: Expansion Board Photo MAX30003WING: Expansion Board Photo Enlarge+

Key Features

  • Expansion Board
    • 0.9in x 2.0in DIP Form Factor
      • Breadboard Compatible
      • Feather Compatible
    • 6-Pin PMOD Compatible Socket
      • I2C
      • Two Optional GPIO
    • Two Grove Connectors
      • I2C
      • UART
    • 3.5mm Jack for ECG Leads
  • MAX30003 Biopotential AFE
    • Clinical-Grade ECG AFE with High-Resolution Data Converter
      • 15.5 Bits Effective Resolution with 5μVP-P Noise
    • Longer Battery Life Compared to Competing Solutions
      • 85µW at 1.1V Supply Voltage
    • Built-In Heart Rate Detection with Interrupt Feature
      • Eliminates the Need to Run HR Algorithm on the Microcontroller
      • Robust R-R Detection in High-Motion Environment at Extremely Low Power
    • 32-Word FIFO Allows You to Wake Up Microcontroller Every 256ms with Full ECG Acquisition


  • Bio Authentication and ECG-On-Demand Applications
  • Chest Band Heart Rate Monitors for Fitness Applications
  • Single Lead Event Monitors for Arrhythmia Detection
  • Single Lead Wireless Patches for At-Home/In-Hospital Monitoring

Technical Documents

App Note 6556 How to Interface the MAX30003WING ECG AFE with the MAX32630FTHR

Quality and Environmental Data

Request Reliability Report for: MAX30003WING 
Lead-Free Package Tin (Sn) Whisker Reports
Device   Fab Process   Technology   Sample size   Rejects   FIT at 25°C   FIT at 55°C  

Note : The failure rates are summarized by technology and mapped to the associated material part numbers. The failure rates are highly dependent on the number of units tested.

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