Audio Hub with FlexSound Processor

High Integration Enables a Single-Chip Audio Solution for Mobile Platforms

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The MAX98095 is a full-featured audio hub with Maxim's FlexSound® digital signal processor. This highly integrated device provides three I²S/PCM interfaces and powerful, high-performance amplifiers. The FlexSound DSP offers best-in-class noise suppression, echo cancellation, speaker protection, and ambient-aware algorithms to handle all the audio processing needs of portable devices. So you get the highest integration and audio quality possible.

Three differential analog microphone inputs and four 1-bit digital microphone inputs accept audio from main, accessory, and background microphones. Analog line inputs accept four single-ended or two differential audio signals. Three digital audio interfaces support I²S/PCM/TDM audio formats. Three integrated sample rate converters and highly configurable signal routing enable a wide range of use cases.

Integrated amplifiers can output signals from three DACs or any of the analog inputs. Amplifiers include a differential receiver amplifier, a stereo Class D speaker amplifier, a stereo Class H headphone amplifier and four single-ended line outputs.

The IC is fully specified over the -40°C to +85°C extended temperature.

Key Features

  • 102dB DR Stereo DAC (8kHz < fS < 96kHz)
  • 90dB DR Stereo ADC (8kHz < fS < 96kHz)
  • 4.2mW Headphone Playback Power Consumption
  • Stereo, Low-EMI Class D Amplifiers
    • 3.2W/Channel (4Ω, PVDD_ = 5.0V)
    • 1.2W/Channel (8Ω, PVDD_ = 4.2V)
  • Stereo DirectDrive® Headphone Amplifiers
    • 33mW/Channel (32Ω)
  • Differential Receiver Amplifier
  • 2 Stereo Single-Ended/Mono Differential Line Inputs
  • 3 Differential Microphone Inputs
  • FlexSound Audio Processing
    • Enhanced Speakerphone
    • Single/Dual Microphone Noise Suppression
    • Ambient Aware Receiver Output
    • Acoustic Echo Cancellation
  • Three I²S/PCM/TDM Digital Audio Interfaces
  • Asynchronous Digital Mixing and Sample Rate Conversion
  • Extensive Click-and-Pop Reduction Circuitry
  • I²C/SPI Control Interface
  • 108-Bump WLP package (6.4mm x 4.7mm, 0.5mm pitch)
Product Reliability Reports: MAX98095.pdf 
Device   Fab Process   Technology   Sample size   Rejects   FIT at 25°C   FIT at 55°C   Material Composition  

Note : The failure rates are summarized by technology and mapped to the associated material part numbers. The failure rates are highly dependent on the number of units tested.

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