12W+12W, Low-EMI, Spread-Spectrum, Stereo, Class D Amplifier

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The MAX9741 stereo Class D audio power amplifier provides Class AB amplifier performance with Class D efficiency, conserving board space and eliminating the need for a bulky heatsink. Using a Class D architecture, the MAX9741 delivers 12W continuous output power into 8Ω loads. Modulation and switching schemes render the traditional Class D EMI suppression output filter unnecessary.

The MAX9741 offers two modulation schemes: a fixed-frequency mode (FFM), and a spread-spectrum mode (SSM) that reduces EMI-radiated emissions due to the modulation frequency. The device utilizes a fully differential architecture, a full bridged output, and offers comprehensive click-and-pop suppression.

The MAX9741 features high 80dB PSRR, low 0.07% THD+N, and SNR in excess of 100dB. Short-circuit and thermal-overload protection prevent the device from being damaged during a fault condition. The MAX9741 is available in a 56-pin TQFN (8mm x 8mm x 0.8mm) package. The MAX9741 is specified over the extended -40°C to +85°C temperature range.
MAX9741: Simplilfied Block Diagram MAX9741: Simplilfied Block Diagram Enlarge+

Key Features

  • Low EMI
  • Unique Spread-Spectrum Mode Offers 5dB Emissions Improvement Over Conventional Methods
  • Up to 88% Efficient into 16Ω
  • 12W+12W Continuous Output Power into 8Ω
  • 15W+15W Continuous Output Power into 16Ω
  • Low 0.07% THD+N
  • High PSRR (80dB at 1kHz)
  • 10V to 25V Single-Supply Operation
  • Differential Inputs Minimize Common-Mode Noise
  • Pin-Selectable Gain Reduces Component Count
  • Industry-Leading Click-and-Pop Suppression
  • Low Quiescent Current (24mA)
  • Low-Power Shutdown Mode (0.2µA)
  • Short-Circuit and Thermal-Overload Protection
  • Available in Thermally Efficient, Space-Saving 56-Pin TQFN (8mm x 8mm x 0.8mm) Package


  • Automotive
  • Desktop PCs
  • LCD Monitors
  • LCD Projectors
  • LCD TVs

MAX9741EVKIT: Evaluation Kit for the MAX9741

CAD Symbols and Footprints

  • MAX9741ETN+D
  • MAX9741ETN+TD
  • Device   Fab Process   Technology   Sample size   Rejects   FIT at 25°C   FIT at 55°C  

    Note : The failure rates are summarized by technology and mapped to the associated material part numbers. The failure rates are highly dependent on the number of units tested.

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