1.3W, Filterless, Stereo Class D Audio Power Amplifier

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The MAX9701 stereo Class D audio power amplifier provides Class AB amplifier audio performance with the benefits of Class D efficiency, eliminating the need for a heatsink while extending battery life. The MAX9701 delivers up to 1.3W per channel into an 8Ω load while offering 87% efficiency. Maxim's next-generation, low-EMI modulation scheme allows the amplifier to operate without an external LC filter while still meeting FCC EMI emission levels.

The MAX9701 offers two modulation schemes: a fixed-frequency (FFM) mode, and a spread-spectrum (SSM) mode that reduces EMI-radiated emissions. The MAX9701 oscillator can be synchronized to an external clock through the SYNC input, allowing synchronization of multiple Maxim Class D amplifiers. The sync output (SYNC_OUT) can be used for a master-slave application where more channels are required. The MAX9701 features a fully differential architecture, a full bridge-tied load (BTL) output, and comprehensive click-and-pop suppression. The device features internally set gains of 0dB, 6dB, 12dB, and 18dB selected through two gain-select inputs, further reducing external component count.

The MAX9701 features high 80dB PSRR, less than 0.1% THD+N, and SNR in excess of 88dB. Short-circuit and thermal-overload protection prevent the device from being damaged during a fault condition. The MAX9701 is available in 24-pin thin QFN-EP (4mm x 4mm x 0.8mm) and 20-bump UCSP™ (2mm x 2.5mm x 0.6mm) packages. The MAX9701 is specified over the extended -40°C to +85°C temperature range.

MAX9701: Block Diagram MAX9701: Block Diagram Enlarge+

Key Features

  • Spread-Spectrum Modulation Lowers Radiated Emissions
  • Single-Supply Operation (2.5V to 5.5V)
  • 1.3W Stereo Output (8Ω, VDD = 5V, THD+N = 1%)
  • No LC Output Filter Required
  • 87% Efficiency (RL = 8Ω, POUT = 1000mW)
  • Less Than 0.1% THD+N
  • High 80dB PSRR
  • Fully Differential Inputs
  • Integrated Click-and-Pop Suppression
  • Typical Low Quiescent Current (9mA)
  • Typical Low-Power Shutdown Mode (0.1µA)
  • Short-Circuit and Thermal-Overload Protection
  • Available in Thermally Efficient, Space-Saving Packages
    • 24-Pin Thin QFN-EP (4mm x 4mm x 0.8mm)
    • 20-Bump UCSP (2mm x 2.5mm x 0.6mm)


  • Automotive Multimedia
  • Cell Phones
  • Docking Stations
  • Handheld Gaming Consoles
  • MP3 Player
  • Multimedia Phones
  • PDA Phone
  • PMP Player
  • Smartphones

CAD Symbols and Footprints

  • MAX9701EBP+TG45
  • Device   Fab Process   Technology   Sample size   Rejects   FIT at 25°C   FIT at 55°C  

    Note : The failure rates are summarized by technology and mapped to the associated material part numbers. The failure rates are highly dependent on the number of units tested.

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