Quad, Ultra-Low-Power, 300Mbps ATE Drivers/Comparators

Low Cost, Low-Power ATE Pin Electronics for Memory, Burn-In, and Structural Automated Test Equipment

Please check latest availability status for a specific part variant.


The MAX9972 four-channel, ultra-low-power, pin-electronics IC includes, for each channel, a three-level pin driver, a window comparator, a passive load, and force-and-sense Kelvin-switched parametric measurement unit (PMU) connections. The driver features a -2.2V to +5.2V voltage range, includes high-impedance and active-termination (3rd-level drive) modes, and is highly linear even at low voltage swings. The window comparator features 500MHz equivalent input bandwidth and programmable output voltage levels. The passive load provides pullup and pulldown voltages to the device-under-test (DUT).

Low-leakage, high-impedance, and terminate controls are operational configurations that are programmed through a 3-wire, low-voltage, CMOS-compatible serial interface. High-speed PMU switching is realized through dedicated digital control inputs.

This device is available in an 80-pin, 12mm x 12mm body, 0.50mm pitch TQFP with an exposed 6mm x 6mm die pad on the bottom of the package for efficient heat removal. The MAX9972 is specified to operate over the 0°C to +70°C commercial temperature range, and features a die temperature monitor output.
MAX9972: Block Diagram MAX9972: Block Diagram Enlarge+

Key Features

  • Small Footprint—Four Channels in 0.3in²
  • Low-Power Dissipation: 325mW/Channel (typ)
  • High Speed: 300Mbps at 3VP-P
  • -2.2V to +5.2V Operating Range
  • Active Termination (3rd-Level Drive)
  • Integrated PMU Switches
  • Passive Load
  • Low-Leak Mode: 20nA (max)
  • Low Gain and Offset Error


  • Active Burn-In Systems
  • DRAM Probe Testers
  • Low-Cost Mixed-Signal/System-on-Chip (SoC) Testers
  • NAND Flash Testers
  • Structural Testers

Quality and Environmental Data

Product Reliability Reports: MAX9972.pdf 
Lead-Free Package Tin (Sn) Whisker Reports

Additional Resources

Digital Frontier Customer Success Story ›

Device   Fab Process   Technology   Sample size   Rejects   FIT at 25°C   FIT at 55°C  

Note : The failure rates are summarized by technology and mapped to the associated material part numbers. The failure rates are highly dependent on the number of units tested.

Quality Management System >
Environmental Management System >


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