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Octal 3.0Gbps DCL with Integrated Level Setting DACs, Cable Droop Compensation, and PMU switches

Industry's Fastest Octal-Channel Pin Electronics Driver

Product Details

Key Features

Simplified Block Diagram

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Key Features

  • Low Power at High-Speed Maximizes Driver Performance
    • Typical 0.89W Per Channel Power Dissipation
    • 10nA Low-Leak Mode
    • High-Speed Data Rate (50Ω)
      • 3.0Gbps Typical at 0.1Vpp
      • 2.5Gbps Typical at 0.5Vpp
      • 2.4Gbps Typical at 0.75Vpp
      • 1.3Gbps Typical at 1.5Vpp
    • Voltage Range from -1.5V to +4.5V
    • Integrated VHH Programming Mode (4th-Level Drive) up to 7.1V
  • Integrated Functionality Provides Value-Add Features
    • Integrated ±12mA Passive Load
    • Programmable Double Time Constant Cable Droop Compensation–Drive and Receive Paths
    • Digital Slew-Rate Control for EMI-Sensitive Applications
    • 64 Independent 14-bit Level-Setting DACs
    • 50MHz SPI Interface

Applications/Uses

  • SoC ATE
  • Memory ATE
  • Digital Testers
  • Burn-In Testers
  • Wafer Testers

Description

The MAX32007 is a fully integrated, high performance, high speed 3Gbps octal-channel pin electronics driver that integrates multiple automatic test equipment (ATE) functions into a single IC. This DCL (driver/comparator/load) device is compatible with most high-speed logic families and includes a 4-level driver, dynamic clamps, window comparator, passive load, differential comparator, slew rate control, driver and comparator cable droop compensation, voltage clamps, PMU switches, and level-setting DACs.

The MAX32007 driver features a -1.5V to +4.5V input range, high-impedance mode, active-termination (3rd-level drive), and VHH programming (4th-level drive) up to 7.1V. The window comparators provide low timing variation over changes in slew rate, pulse width, or overdrive voltage. The MAX32007 features dynamic clamps that limit high-speed device-under-test (DUT) waveforms as well as cable droop compensation for optimization of driver and return path signals. The integrated passive load is rated for ±12mA. Configuration of the many features are done through a 50MHz SPI interface.

The MAX32007 is available in a 16mm x 10mm x 1.4mm csBGA package with exposed pad on the top for easy heat removal. The ball pitch is 0.8mm with a ball grid array of 19x12. Typical power dissipation is rated for 0.89W per channel. The MAX32007 operates over an internal die temperature range of +40°C to +100°C with a nominal operating point of +70°C. The device provides both a temperature monitor output (TSA) and an over-temp indicator (TSD).

Simplified Block Diagram

Technical Docs

Support & Training

Search our knowledge base for answers to your technical questions.

Filtered Search

Our dedicated team of Applications Engineers are also available to answer your technical questions. Visit our support portal .