MAX9977

Quad, Low-Power, 1200Mbps ATE Driver


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Description

The MAX9977 quad, low-power, high-speed, pin-electronics driver includes, for each channel, a three-level pin driver. The driver features a wide voltage range and high-speed operation, includes high-impedance and active-termination (3rd-level drive) modes, and is highly linear even at low voltage swings.

The MAX9977 provides high-speed, differential control inputs with internal 50Ω (100Ω LVDS) termination resistors that allow compatibility with 1.8V and 3.5V terminated 0.4VP-P CML, reducing the discrete component count required on the circuit board. The MAX9977AD has no internal termination.

A 3-wire, low-voltage, CMOS-compatible serial interface programs the low-leakage and tri-state/terminate operational configurations of the MAX9977.

The MAX9977's operating range is -1.5V to +6.5V (consult factory for other operating ranges), and features a maximum power dissipation of only 0.8W per channel. The device is available in a 100-pin, 14mm x 14mm x 0.1mm body, and 0.5mm pitch TQFP. An exposed 8mm x 8mm die pad on the top of the package facilitates efficient heat removal. The device is specified to operate with an internal die temperature of +60°C to +100°C, and features a die temperature monitor output.

MAX9977: Functional Diagram MAX9977: Functional Diagram Enlarge+

Key Features

  • Low Power Dissipation: 0.8W/Channel
  • High Speed: 1200Mbps at 3VP-P and 1800Mbps at 1VP-P
  • Low Timing Dispersion
  • Wide -1.5V to +6.5V Operating Range
  • Interfaces Easily with Most Logic Families
  • Active Termination (3rd-Level Drive)
  • Internal 50Ω Termination Resistors on Control Inputs
  • Low Gain and Offset Errors
  • Pin Compatible with the MAX9963 and MAX9965 Quad Drivers
  • Applications/Uses

    • Medium-Performance System-on-Chip ATE and Memory Applications
    Request Reliability Report for: MAX9977 
    Device   Fab Process   Technology   Sample size   Rejects   FIT at 25°C   FIT at 55°C   Material Composition  

    Note : The failure rates are summarized by technology and mapped to the associated material part numbers. The failure rates are highly dependent on the number of units tested.

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