10MHz to 51.84MHz TCXO

Digital TCXO Provides Extremely High Accuracy Over Wide Temperature Range

Please check latest availability status for a specific part variant.


The DS4026 is a temperature-compensated crystal oscillator (TCXO) that provides ±1ppm frequency stability over the -40°C to +85°C industrial temperature range. The DS4026 is also available in Stratum 3 versions (see the Ordering Information—Stratum 3 table in the full data sheet). Each device is factory calibrated over temperature to achieve the ±1ppm frequency stability. Standard frequencies for the device include 10, 12.8, 19.44, 20, 38.88, 40, and 51.84MHz. Contact the factory for custom frequencies.

The DS4026 provides excellent phase-noise characteristics. The output is a push-pull CMOS square wave with symmetrical rise and fall times. In addition, the DS4026 is designed to provide a maximum frequency deviation of less than ±4.6ppm over 20 years. The device also provides an I²C interface to allow pushing and pulling of the output frequency by a minimum of ±8ppm (±5ppm for 10MHz) with typical 1ppb resolution.

The DS4026 implements a temperature-to-voltage conversion with a nonlinear relationship. The output from the temperature-to-voltage converter is used to drive the voltage-controlled crystal oscillator to compensate for frequency change.

The device implements an on-chip temperature sensor lookup table, and a digital-to-analog converter (DAC) to adjust the frequency. An I²C interface used to communicate with the DS4026 performs temperature readings and frequency push-pull.
DS4026: Functional Diagram DS4026: Functional Diagram Enlarge+

Key Features

  • ±1ppm Frequency Accuracy Over -40°C to +85°C
  • Standard Frequencies: 10, 12.8, 19.44, 20, 38.88, 40, 51.84MHz
  • Stratum 3 Frequencies: 10, 12.8, 19.2, 20MHz
  • Maximum ±4.6ppm Deviation Over 20 Years
  • Minimum ±8ppm (±5ppm for 10MHz) Digital Frequency Tuning Through I²C Interface
  • Surface-Mount 16-Pin SO Package
  • Pb Free/RoHS Compliant


  • Reference Clock Generation
  • Telecom/Datacom/SatCom
  • Test and Measurement
  • Wireless

Technical Documents

Tutorial 5100 General Layout Guidelines for RF and Mixed-Signal PCBs
Product Reliability Reports: DS4026.pdf 
Device   Fab Process   Technology   Sample size   Rejects   FIT at 25°C   FIT at 55°C   Material Composition  

Note : The failure rates are summarized by technology and mapped to the associated material part numbers. The failure rates are highly dependent on the number of units tested.

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