Manufacturing Defect Analysis Guidelines for MAX16545 and MAX16543

Abstract: Manufacturing Defect Analysis can be used to detect missing components and connections in a circuit board assembly. It is accomplished by injecting small signals at as many nets as possible while monitoring the voltage at the injection point and other nets for evidence of a short, open, or failed component. This application note describes the signal amplitude constraints that must be followed to avoid damaging the MAX16545 and MAX16543 devices.