Manufacturing Defect Analysis Guidelines for MAX16545 and MAX16543

Abstract: Manufacturing Defect Analysis can be used to detect missing components and connections in a circuit board assembly. It is accomplished by injecting small signals at as many nets as possible while monitoring the voltage at the injection point and other nets for evidence of a short, open, or failed component. This application note describes the signal amplitude constraints that must be followed to avoid damaging the MAX16545 and MAX16543 devices.

Next Steps
EE-Mail Subscribe to EE-Mail and receive automatic notice of new documents in your areas of interest.
© , Maxim Integrated Products, Inc.
The content on this webpage is protected by copyright laws of the United States and of foreign countries. For requests to copy this content, contact us.
APP 6801:
APPLICATION NOTE 6801,AN6801, AN 6801, APP6801, Appnote6801, Appnote 6801