HFAN-08.0.1: Understanding Bonding Coordinates and Physical Die Size

Abstract: When calculating pad coordinates, there is often confusion between die size specified in the data sheet and the physical die size after it is cut from the wafer. The physical edge of the die is not a good reference for wire bonding because of slight inconsistencies of overall die dimensions. This application note will briefly discuss die dimensions, die orientation, bonding coordinates, and how to calculate the physical die size. The MAX3970 will be used as an example.

Next Steps
EE-Mail Subscribe to EE-Mail and receive automatic notice of new documents in your areas of interest.
Download Download, PDF Format
© , Maxim Integrated Products, Inc.
The content on this webpage is protected by copyright laws of the United States and of foreign countries. For requests to copy this content, contact us.
APP 630:
APPLICATION NOTE 630,AN630, AN 630, APP630, Appnote630, Appnote 630