APPLICATION NOTE 630

HFAN-08.0.1: Understanding Bonding Coordinates and Physical Die Size


Abstract: When calculating pad coordinates, there is often confusion between die size specified in the data sheet and the physical die size after it is cut from the wafer. The physical edge of the die is not a good reference for wire bonding because of slight inconsistencies of overall die dimensions. This application note will briefly discuss die dimensions, die orientation, bonding coordinates, and how to calculate the physical die size. The MAX3970 will be used as an example.

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APP 630:
APPLICATION NOTE 630,AN630, AN 630, APP630, Appnote630, Appnote 630