Keywords: MAX5861, SCQAM, QAM, OFDM, modulator, RF-DAC, digital-to-analog converter, thermal, model Related Parts
APPLICATION NOTE 6110
MAX5861 Thermal Model Considerations
Abstract:This guide describes the package thermal model and discusses design considerations for the MAX5861, DOCSIS 3.1 compliant high-density downstream cable SCQAM and OFDM modulator, digital up-converter (DUC) and RF digital-to-analog converter (DAC) device.
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APPLICATION NOTE
6110,
AN6110,
AN 6110,
APP6110,
Appnote6110,
Appnote 6110
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