APPLICATION NOTE 6110

MAX5861 Thermal Model Considerations


Abstract: This guide describes the package thermal model and discusses design considerations for the MAX5861, DOCSIS 3.1 compliant high-density downstream cable SCQAM and OFDM modulator, digital up-converter (DUC) and RF digital-to-analog converter (DAC) device.


This document is written for a highly specific application and contains information about proprietary technology, and is only available to customers whose requirements closely match the application. To request the full document, please complete the form below.

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APPLICATION NOTE 6110,AN6110, AN 6110, APP6110, Appnote6110, Appnote 6110