MAX5861 Thermal Model Considerations

Abstract: This guide describes the package thermal model and discusses design considerations for the MAX5861, DOCSIS 3.1 compliant high-density downstream cable SCQAM and OFDM modulator, digital up-converter (DUC) and RF digital-to-analog converter (DAC) device.

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APPLICATION NOTE 6110,AN6110, AN 6110, APP6110, Appnote6110, Appnote 6110