Package Thermal Resistance Values for Temperature Sensors & 1-Wire Devices

Abstract: Two common thermal-resistance values measured for IC packages are junction to ambient (Theta JA) and junction to case (Theta JC). These parameters are useful for calculating maximum power dissipation and self-heating, and for comparing package types. Theta JA and Theta JC values are presented here for select Maxim temperature sensors and 1-Wire® devices. Examples for calculating the values are given.