MAX21610

Automotive 16-Channel 100mA Local Dimming Backlight Driver with SPI Interface

16-Channel 100mA LED Local Dimming Driver Provides Full Diagnostics through SPI


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说明

The MAX21610 is a 16-channel modular backlight driver for use with automotive displays. The integrated current outputs can sink up to 100mA LED current, each depending on the ambient temperature. Device power comes from an external 3.3V or 5V supply, while the LED current-sink outputs can operate at up to 17V.

A feedback output pin (FB) is provided to control an external DC-DC converter so that voltage headroom can be optimized and the overall system power dissipation reduced.

The global LED current for all strings is set through a serial peripheral interface (SPI), with individual PWM settings for each of the channels. The PWM frequency can be determined using the internal oscillator or by synchronizing to the external CLKIO input.

The device features a high-speed SPI interface for control. Up to 10 devices can be daisy-chained to reduce connection complexity.

The MAX21610 is available in a TQFN package and operates in the -40 to 125°C temperature range.

关键特性

  • High Integration
    • Complete 16-Channel Solution with Independent Dimming and Daisy-Chain Option
    • SPI Control for Minimum Parts Count
  • Robust and Low EMI
    • Programmable Spread Spectrum On Outputs
    • Slew-Rate Controlled Switching On LED Outputs
    • Programmable Phase Shift Between Outputs
  • Relative Dimming Ratio Between Strings Up to 32768:1
  • Latch Input (RST_LAT) for Synchronization to Video Frame
  • FB Output to Control External Power Supply for Minimum System Power Dissipation
  • 1% Accurate Output Current
  • Complete Diagnostics
    • LED Open/Short Detection and Protection
    • Power Supply Overvoltage Protection
    • Thermal Warning
    • Thermal Shutdown
  • Compact 32-Pin TQFN 5mm x 5mm Package

应用

  • 中央信息显示屏
  • 信息娱乐系统显示屏
  • 仪表盘

MAX21610EVKIT: Evaluation Kit for the MAX21610

质量和环境数据

申请可靠性报告: MAX21610 
无铅封装的锡(Sn)晶须报告
型号   生产流程   工艺   样本量   不合格   FIT @ 25°C   FIT @ 55°C  

备注: 通过技术手段对故障率进行汇总,并映射到相关的材料部件号。 故障率与被测件的数量密切相关。

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