MAX32570

Low-Power Arm Cortex-M4 Microcontroller with Contactless Radio for Secure Applications

Highly-Integrated, Low-Power Microcontroller with Contactless Interface


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说明

The DeepCover® secure microcontroller (MAX32570) provides an interoperable, secure, and cost-effective solution to build new generations of trusted devices. It can be used in single-chip applications such as pinpads, mobile POS (MPOS), and secure card reader for PIN (SCRP), but also in dual-chip applications such as countertop and tablet POS. It includes all the essential functions to address those applications including a multi-protocol RF contactless controller and radio front-end, a dual smart card controller, a parallel camera inteface, a magnetic stripe reader, a TFT controller and a secure keypad controller.

The MAX32570 operates at 150MHz and is based on an Arm® Cortex®-M4 processor with FPU with 1MB flash, 760KB SRAM, 4KB OTP, 1KB of battery-backed AES self-encrypted NVSRAM and a 256-bit flip-flop based battery-backed key storage. The flash memory is split into 2 banks of 512KB to provide flexibility when programming over-the-air. Error correction coding (ECC) (single error correction double error detection) for flash, and SRAM provides extremely reliable code execution. The device embeds both secure public and private key cryptographic algorithms and a true random number generator (TRNG) compliant with SP-800-90A and SP-800-90B standards. It also features a number of security protections and detectors to enforce system integrity including a dynamic sensor controller, environmental sensors, and fault detectors.

The device features five flexible power modes. Multiple SPI, UART, and I²C serial interfaces, as well as a QSPI, 1-Wire® master, and USB 2.0 High-Speed device and anoptional 10/100 Ethernet MAC, allow for greater connectivity. The device offers, on some package variants, flexible off-chip memory expansion that supports SD/SDHC,SDIO/eMMC cards, QSPI flash, and SRAM memories with eXecute In Place (XIP), encryption, and authentication.The device is available in a number of package variantsranging from BGA-81 to BGA-169, 0.65mm pitch package.

关键特性

  • High-Efficiency Microcontroller for Secure Battery-Powered Applications
    • Arm Cortex-M4 Processor with FPU Up to 150MHz
    • 150MHz and 75MHz Internal Oscillators
    • Low-Power 7.37MHz System Clock Option
    • 1MB Flash, Organized into Dual Banks 2 x 512KB
    • 760KB (608KB ECC) SRAM
    • Optional Error Correction Code (ECC-SEC-DED) for Cache, SRAM, and Internal Flash
    • 1KB AES Encrypted NVSRAM and 16KB Internal OTP
  • Scalable Cached External Memory Interfaces
    • QSPI Flash with AES-GCM and XiP
    • QSPI SRAM with AES-GCM and XiP
    • 150Mbps SDHC/eMMC/SDIO/microSD Interface
  • Security Features Facilitates System-Level Protection
    • ISO1443A, ISO1443B, JIS X 6319-4, ISO15693 Contactless Reader with Internal Transceiver
    • Secure Boot Loader with Public Key Authentication
    • Hardware AES, DES, ECDSA and SHA-2 engines
    • 10-Line Secure Keypad Controller*
    • TRNG (SP-800-90A and SP-800-90B)
    • 6 External Dynamic Tamper Sensors
    • Die Shield with Dynamic Random Signal
    • 1x 256-Bit and 2x 128-Bit Flip-Flop-Based AES Key Storage
    • Temperature and Voltage Tamper Monitor
    • Fault Detectors
  • Optimal Peripheral Mix Provides Platform Scalability
    • 16-Channel DMA and Two Smart DMAs
    • One QSPI/SPI Master
    • Up to Three SPI Master (37.5MHz)/Slave (75MHz)
    • Up to Six 4Mbaud UARTs with Flow Control
    • Up to Two ISO7816 UART/Smart Card Controller
    • Up to Three 1MHz I2C Master/Slave
    • Up to Three Channels 7.8ksps 10-Bit Delta-SigmaADC
    • USB 2.0 High-Speed Device Interface with PHY
    • 10/100 Ethernet MAC with RMII/MII Support
    • 24-Bit TFT LCD Controller
    • 12-Bit Parallel Camera Interface
    • Triple-Track Magnetic Stripe Head Interface
    • Eight Pulse Train Generators
    • Six 32-Bit Timers, Two High-Speed Timers
    • 1-Wire Master, Two Watchdog Timers
    • Real-Time Clock

应用

  • ATM键盘
  • null
  • null
  • PCI移动支付终端(mPOS)
  • null

MAX32570-MNKIT: Evaluation Kit for the MAX32570

质量和环境数据

申请可靠性报告: MAX32570 
无铅封装的锡(Sn)晶须报告
型号   生产流程   工艺   样本量   不合格   FIT @ 25°C   FIT @ 55°C  

备注: 通过技术手段对故障率进行汇总,并映射到相关的材料部件号。 故障率与被测件的数量密切相关。

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