MAX14824

IO-Link主机收发器

业内最高的C/Q驱动器输出


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说明

The MAX14824 is an IO-Link® master interface that integrates an IO-Link physical layer transceiver with an auxiliary digital input and two linear regulators. High port count IO-Link master applications are supported through in-band SPI addressing, and the 12MHz SPI interface minimizes host controller access times. In-band addressing and selectable SPI addresses enable cascading up to 16 devices.

The device supports all the IO-Link data rates and features slew-rate-controlled drivers to reduce EMI. The driver is guaranteed to drive up to 300mA (min) load currents. Internal wake-up circuitry automatically determines the correct wake-up polarity, allowing for the use of simple UARTs for wake-up pulse generation.

The MAX14824 is available in a 4mm x 4mm, 24-pin TQFN package with exposed pad, and operates over the extended -40°C to +105°C temperature range.

MAX14824: Typical Operating Circuit MAX14824: Typical Operating Circuit 放大+

关键特性

  • 兼容IO-Link v.1.0和v.1.1物理层
  • 支持COM1、COM2和COM3数据传输率
  • 推挽式、高端或低端输出
  • 300mA C/Q输出驱动
  • 1µF C/Q负载驱动力
  • 产生500mA唤醒脉冲
  • 自动唤醒脉冲极性
  • 辅助数字输入
  • 5V和3.3V线性稳压器
  • 配置与监测采用SPI接口
  • 基于SPI芯片寻址
  • EMI发射控制采用摆率控制驱动器
  • DI反极性保护
  • C/Q短路保护
  • 高温预警和热关断
  • 故障检测与报告
  • 工作温度范围:-40°C至+105°C
  • 4mm x 4mm TQFN封装

应用

  • 24V数字输入、输出
  • 多端口IO-Link主机
  • IO-Link主控制器
  • PLC现场总线网关
Part NumberFunctionsVCC
(V)
VCC
(V)
C/Q
(mA)
DI Input Threshold
(V)
DI Input Threshold
(V)
Slew Rate LimitingLogic-Level Supply Voltage
(V)
Integrated PowerProtection FeaturesPackage/PinsOper. Temp.
(°C)
Budgetary
Price
minmaxtyphighlowSee Notes
MAX14824 Master Transceiver9363756.8 to 135.2 to 11.5Yes2.3 to 5.5
3.3V LDO
5V LDO
High Temp Warning and Shutdown
Reverse Polarity
Short Circuit
UVLO
TQFN/24
-40 to +105$4.45 @1k
查看所有IO-Link Transceivers and Binary Drivers (14)
Pricing Notes:
价格仅供参考,用于同类产品的比较。所提供报价为美元,需要依汇率折合成人民币。该价格将因当地关税、税率和汇率而异。有关特定订购量和指定版本的报价和供货问题,请参考:价格与供货网站或与指定代理商联系。


MAX14824EVKIT: MAX14824评估板
型号   生产流程   工艺   样本量   不合格   FIT @ 25°C   FIT @ 55°C  

备注: 通过技术手段对故障率进行汇总,并映射到相关的材料部件号。 故障率与被测件的数量密切相关。

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