DS2409

MicroLAN耦合器


点击查看特定型号的库存状况。

说明

The MicroLAN coupler is an essential component to build and control 1-Wire® networks with multi-level branching. In contrast to approaches that switch the ground line, the coupler maintains a common ground level for the whole network and keeps the inactive segments powered. This simplifies supplying central or local power for additional circuitry and prevents loss of status of parasitically powered devices. It also avoids disrupting communication caused by the parasitic power supply of 1-Wire devices after activating a branch. Both the main and the auxiliary 1-Wire output are supported by a smart-on command. This command generates a reset/presence sequence on the selected output before the electronic switch closes the contact to the 1-Wire bus. This way the bus master can apply a ROM function command (optionally followed by a memory function) to the devices on the just activated segment with all other devices in the network remaining deselected. This significantly speeds up the analysis of topology and population in a continuously changing network. The coupler also supports the bus master in detecting arrivals on the inactive segments of the network by responding to the conditional search command.

关键特性

  • Low impedance coupler to create large common-ground, multi-level 1-Wire networks
  • Keeps inactive branches pulled high to 5V
  • Simplifies network topology analysis by logically decoupling devices on active network segments
  • Conditional search for fast-event signaling
  • Auxiliary 1-Wire line to connect a memory chip or to be used as digital input
  • Programmable, general-purpose open-drain control output
  • Communicates at 16.3kbps
  • Unique, factory-lasered and tested 64-bit registration number assures absolute traceability because no two parts are alike
  • Built-in multidrop controller ensures compatibility with other 1-Wire products
  • Operating temperature range from -40°C to +85°C
  • Compact, low-cost 6-pin TSOC surface mount package

技术资料

应用笔记 4930 DS2409 MicroLAN™耦合器设计替代方案
应用笔记 2965 1-Wire Master Device Configuration
应用笔记 155 1-Wire软件资源指南和器件说明

质量和环境数据

产品可靠性报告: DS2409.pdf 
无铅封装的锡(Sn)晶须报告
型号   生产流程   工艺   样本量   不合格   FIT @ 25°C   FIT @ 55°C  

备注: 通过技术手段对故障率进行汇总,并映射到相关的材料部件号。 故障率与被测件的数量密切相关。

质量管理体系 >
环境管理体系 >

 
Status:
Package:
Temperature:

相关资料