The MicroLAN coupler is an essential component to build and control 1-Wire® networks with multi-level branching. In contrast to approaches that switch the ground line, the coupler maintains a common ground level for the whole network and keeps the inactive segments powered. This simplifies supplying central or local power for additional circuitry and prevents loss of status of parasitically powered devices. It also avoids disrupting communication caused by the parasitic power supply of 1-Wire devices after activating a branch. Both the main and the auxiliary 1-Wire output are supported by a smart-on command. This command generates a reset/presence sequence on the selected output before the electronic switch closes the contact to the 1-Wire bus. This way the bus master can apply a ROM function command (optionally followed by a memory function) to the devices on the just activated segment with all other devices in the network remaining deselected. This significantly speeds up the analysis of topology and population in a continuously changing network. The coupler also supports the bus master in detecting arrivals on the inactive segments of the network by responding to the conditional search command.


  • Low impedance coupler to create large common-ground, multi-level 1-Wire networks
  • Keeps inactive branches pulled high to 5V
  • Simplifies network topology analysis by logically decoupling devices on active network segments
  • Conditional search for fast-event signaling
  • Auxiliary 1-Wire line to connect a memory chip or to be used as digital input
  • Programmable, general-purpose open-drain control output
  • Communicates at 16.3kbps
  • Unique, factory-lasered and tested 64-bit registration number assures absolute traceability because no two parts are alike
  • Built-in multidrop controller ensures compatibility with other 1-Wire products
  • Operating temperature range from -40°C to +85°C
  • Compact, low-cost 6-pin TSOC surface mount package
产品可靠性报告: DS2409.pdf 
型号   生产流程   工艺   样本量   不合格   FIT @ 25°C   FIT @ 55°C   Material Composition  

备注: 通过技术手段对故障率进行汇总,并映射到相关的材料部件号。 故障率与被测件的数量密切相关。

质量管理体系 >
环境管理体系 >