MAX2362

完备的双频段正交发送器

业内集成度最高的发送IC,用于双频蜂窝电话


点击查看特定型号的库存状况。

说明

The MAX2360 dual-band, triple-mode complete transmitter for cellular phones represents the most integrated and architecturally advanced solution to date for this application. The device takes a differential I/Q baseband input and mixes it up to IF through a quadrature modulator and IF variable-gain amplifier (VGA). The signal is then routed to an external bandpass filter and upconverted to RF through an SSB mixer and RF VGA. The signal is further amplified with an on-board PA driver. Dual IF synthesizers, dual RF synthesizers, a local oscillator (LO) buffer, and a 3-wire programmable bus complete the basic functional blocks of this IC. The MAX2362 supports single-band, single-mode (PCS) operation. The MAX2364 supports single-band cellular dual-mode operation.

The MAX2360 enables architectural flexibility because its two IF voltage-controlled oscillators (VCOs), two IF ports, two RF LO input ports, and three PA driver output ports allow the use of a single receive IF frequency and split-band PCS filters for optimum out-of-band noise performance. The PA drivers allow up to three RF SAW filters to be eliminated. Select a mode of operation by loading data on the SPI™/QSPI™/MICROWIRE™-compatible 3-wire serial bus. Charge-pump current, sideband rejection, IF/RF gain balancing, standby, and shutdown are also controlled with the serial interface.

The MAX2360/MAX2362/MAX2364 come in a 48-pin TQFP-EP package and are specified for the extended (-40°C to +85°C) temperature range.

关键特性

  • Dual-Band, Triple-Mode Operation
  • +7dBm Output Power with -54dBc ACPR
  • 100dB Power Control Range
  • Supply Current Drops as Output Power Is Reduced
  • Dual Synthesizer for IF and RF LO
  • Dual On-chip IF VCO
  • QSPI/SPI/MICROWIRE-Compatible 3-Wire Bus
  • Digitally Controlled Operational Modes
  • +2.7V to +5.5V Operation
  • Single Sideband Upconverter Eliminates SAW Filters

应用

  • 高速数据调制解调器
  • 高速数字无绳电话
  • 卫星电话
  • 三模、双模或单模移动电话
  • 无线数据链接(WAN/LAN)
  • 无线局域网(WLAN)
  • 无线本地环路(WLL)

技术资料

设计指南 5100 RF和混合信号PCB的一般布局指南
应用笔记 272 MAX2360中频槽路设计

质量和环境数据

申请可靠性报告: MAX2362 
无铅封装的锡(Sn)晶须报告
型号   生产流程   工艺   样本量   不合格   FIT @ 25°C   FIT @ 55°C  

备注: 通过技术手段对故障率进行汇总,并映射到相关的材料部件号。 故障率与被测件的数量密切相关。

质量管理体系 >
环境管理体系 >

 
Status:
Package:
Temperature:

相关资料

类型 编号 PDF 标题
设计指南 5100 RF和混合信号PCB的一般布局指南
应用笔记 272 MAX2360中频槽路设计