MAX3669

+3.3V、622Mbps、 SDH/SONET激光驱动器,带有电流监测和自动功率控制

低功耗、功能完备的622Mbps激光驱动器


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说明

The MAX3669 is a complete, +3.3V laser driver with automatic power control (APC) circuitry for SDH/SONET applications up to 622Mbps. It accepts differential PECL inputs, provides bias and modulation currents, and operates over a temperature range from -40°C to +85°C.

An APC feedback loop is incorporated to maintain a constant average optical power over temperature and lifetime. The wide modulation current range from 5mA to 75mA and bias current of 1mA to 80mA are easy to program, making this product ideal for use in various SDH/SONET applications. Two pins are provided to monitor the current levels in the laser: BIASMON with current proportional to laser bias current, and MODMON with current proportional to laser modulation.

The MAX3669 also provides enable control and a failure-monitor output to indicate when the APC loop is unable to maintain the average optical power. The MAX3669 is available in 4mm x 4mm 24-pin thin QFN and 5mm x 5mm 32-pin TQFP packages.
MAX3669:典型应用电路 MAX3669:典型应用电路 放大+

关键特性

  • +3.3V or +5.0V Single-Supply Operation
  • 40mA Supply Current at +3.3V
  • Programmable Bias Current from 1mA to 80mA
  • Programmable Modulation Current from 5mA to 75mA
  • Bias Current and Modulation Current Monitors
  • 200ps Rise/Fall Time
  • Automatic Average Power Control with Failure Monitor
  • Complies with ANSI, ITU, and Bellcore SONET/SDH Specifications
  • Enable Control

应用

  • 622Mbps SDH/SONET接入节点
  • 激光驱动器发送器
  • 段再生器
Part NumberTarget Oper. Range
(Gbps)
Data Rate
(Mbps)
Data Rate
(Mbps)
VSUPPLY
(V)
ICC
(mA)
I/O TypeIMOD
(mA)
IBIAS
(mA)
Package/PinsBudgetary
Price
minmaxtypmaxmaxSee Notes
MAX3669 <1155622
3.3
5
40PECL7580
TQFN/24
TQFP/32
$5.74 @1k
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Pricing Notes:
价格仅供参考,用于同类产品的比较。所提供报价为美元,需要依汇率折合成人民币。该价格将因当地关税、税率和汇率而异。有关特定订购量和指定版本的报价和供货问题,请参考:价格与供货网站或与指定代理商联系。


MAX3669EVKIT: MAX3669评估板
MAX3669ETGEVKIT: MAX3669ETG评估板

技术资料

应用笔记 596 HFAN-02.2.0: Extinction Ratio and Power Penalty

质量和环境数据

产品可靠性报告: MAX3669.pdf 
无铅封装的锡(Sn)晶须报告

CAD Symbols and Footprints

  • MAX3669EHJ+
  • MAX3669EHJ+T
  • MAX3669ETG+
  • MAX3669ETG+T
  • 型号   生产流程   工艺   样本量   不合格   FIT @ 25°C   FIT @ 55°C  

    备注: 通过技术手段对故障率进行汇总,并映射到相关的材料部件号。 故障率与被测件的数量密切相关。

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    相关资料

    类型 编号 PDF 标题
    应用笔记 596 HFAN-02.2.0: Extinction Ratio and Power Penalty