MAX3665

622Mbps、超低功耗,3.3V互阻前置放大器,用于SDH/SONET


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说明

The MAX3665 low-power transimpedance preamplifier for 622Mbps SDH/SONET applications consumes only 70mW at VCC = 3.3V. Operating from a single +3.3V or +5.0V supply, it converts a small photodiode current to a measurable differential voltage. A DC cancellation circuit provides a true differential output swing over a wide range of input current levels, thus reducing pulse-width distortion. The differential outputs are back-terminated with 50Ω per side.

The overall transimpedance gain is nominally 8kΩ. For input signal levels beyond approximately 50µAp-p, the amplifier will limit the output swing to 250mV. The MAX3665's low 55nA input noise provides a typical sensitivity of -33.2dBm in 1300nm, 622Mbps receivers.

The MAX3665 is designed to be used in conjunction with the MAX3676 clock recovery and data retiming IC with limiting amplifier. Together they form a complete 3.3V or 5.0V 622Mbps SDH/SONET receiver.

In die form, the MAX3665 is designed to fit on a header with a PIN diode. It includes a filter connection that provides positive bias for the photodiode through a 1.5kΩ resistor to VCC. The device is available in an 8-pin µMAX® package.
MAX3665:典型应用电路 MAX3665:典型应用电路 放大+

关键特性

  • +3.3V or +5.0V Single-Supply Operation
  • 55nARMS Input-Referred Noise
  • 70mW Power Consumption at VCC = 3.3V
  • 8kΩ Gain
  • 450µA Peak Input Current
  • 260ps (max) Deterministic Jitter
  • Differential Output Drives 100ΩLoad
  • 470MHz Bandwidth

应用

  • PIN光电二极管前置放大器与接收器
  • SDH/SONET发生器
  • SDH/SONET接收器

请查看具体的参数规格 Transimpedance Amplifiers (TIA) (16)


Part NumberTarget Oper. Range
(Gbps)
Data Rate
(Mbps)
VSUPPLY
(V)
ICC
(mA)
Input Noise
(nA)
Bandwidth
(MHz)
ZT
(kΩ)
Package/PinsBudgetary
Price
maxtypmaxminSee Notes
MAX3665 <1622
3.3
5
25624707
DICE SALES/N
UMAX/8
WAFER SAWN/N
$7.00 @1k

Pricing Notes:
价格仅供参考,用于同类产品的比较。所提供报价为美元,需要依汇率折合成人民币。该价格将因当地关税、税率和汇率而异。有关特定订购量和指定版本的报价和供货问题,请参考:价格与供货网站或与指定代理商联系。
产品可靠性报告: MAX3665.pdf 
型号   生产流程   工艺   样本量   不合格   FIT @ 25°C   FIT @ 55°C   Material Composition  

备注: 通过技术手段对故障率进行汇总,并映射到相关的材料部件号。 故障率与被测件的数量密切相关。

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