设计指南 5283

PCB Design Considerations and Guidelines for 0.4mm and 0.5mm WLPs


摘要 : Using a wafer-level package (WLP) can reduce the overall size and cost of your solution. However when using a WLP IC, the printed circuit board (PCB) layout can become more complex and, if not carefully planned, result in an unreliable design. This article presents some PCB design considerations and general recommendations for choosing a 0.4mm- or 0.5mm-pitch WLP for your application.