应用笔记 4926

PHY1066 and PHY1068 Thermal Considerations


摘要 : The Phyworks PHY1066 and PHY1068, high-performance equalizers and retimers for active copper and backplane applications, have a high power density and can get hot in module environments with no airflow. Both of the ICs come in a tiny package that has limited heatsinking capability. This application note discusses methods for maintaining correct junction temperatures through the use of good mechanical module-design practices.


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