How do users define and order the right part? And how do they verify that the parts they receive are correct? This technical brief is designed to help customers interpret the ordering information and package markings for the DS1804.
Any of the three DS1804 resistance values can be purchased in one of four package variations: 8-pin, 300mil DIP; 8-pin, 118mil µSOP; 8-bump, 150mil SOIC; or 15-ball Flip Chip.
Standard lead finish is SnPb (85/15) solder-plating for PDIP, µSOP, or SOIC. Lead-free (Sn) plating is also offered for certain package variations, and is identified with a "+" in the ordering and marking information. Contact the factory for more information on lead-free component availability. Flip Chip balls are PbSn (95/5).
The DIP package is only available in bulk (tubes).
The µSOP package is available in either bulk (tubes) or tape and reel (3000pc).
The SOIC package is available in either bulk (tubes) or tape and reel (2500pc).
The Flip Chip package is only available in tape and reel (3000pc).
For a complete list of DS1804 ordering options or any other Dallas product, go to Tech Support and enter the parent part number (i.e., "DS1804").
For the package diagrams below, use the following key:
|nnn||3-digit resistor value ("010" = 10kΩ, "050" = 50kΩ, "100" = 100kΩ)DIP, µSOP, or Flip Chip|
|n||1 Roman numeral resistor value ("X" = 10kΩ, "L" = 50kΩ, "C" = 100kΩ)SOIC only|
|yy||Last 2 digits of year of assembly|
|ww||Work week of assembly|
|s||1 character date codeFlip Chip only|
|rr||Die revision code|
|###||Last 3 digits of lot number|
|xx||Up to 2 alpha characters of lot number suffix|
|cccccc||Country where device is assembled|
More information on DIP mechanical dimensions
More information on µSOP mechanical dimensions
More information on SOIC mechanical dimensions
More information on Flip Chip mechanical dimensions and recommended substrate land pattern
Questions/comments/suggestions concerning this application note can be sent to: