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设计指南

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基站/无线基础结构

  • 高速ADC
  • 高速DAC
  • 高速信号分配
  •  
  • 无线与RF系统设计

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    96.3kB
    设计指南 5499 
    Spectrum Inversion in NCDMA to Ensure Compliance with 3GPP2
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    338.9kB
    设计指南 5429 
    IP3 and Intermodulation Guide
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    780.5kB
    设计指南 5450 
    Successful PCB Grounding with Mixed-Signal Chips - Follow the Path of Least Impedance
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    137.3kB
    设计指南 5066 
    When Is Calibration Important?
    View   In New Window   设计指南 4636 
    避免ISM-RF产品中的PCB布局“缺陷”
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    49kB
    设计指南 4294 
    Differential Gain and Phase—Why Measure It, if You Cannot See It?
    View   In New Window   设计指南 4053 
    解读高速数/模转换器(DAC)的建立和保持时间
    View   In New Window   设计指南 3822 
    利用相位噪声发生器辅助系统测试
    View   In New Window   设计指南 2875 
    噪声系数测量的三种方法
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    289.5kB
    设计指南 729 
    Dynamic Testing of High-Speed ADCs, Part 2
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    92kB
    设计指南 634 
    Pipeline ADCs Come of Age
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    207.4kB
    设计指南 728 
    Defining and Testing Dynamic Parameters in High-Speed ADCs, Part 1
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    72.1kB
    设计指南 989 
    Multiply Your Sampling Rate with Time-Interleaved Data Converters

    高速ADC

    View   In New Window PDF
    780.5kB
    设计指南 5450 
    Successful PCB Grounding with Mixed-Signal Chips - Follow the Path of Least Impedance
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    67kB
    设计指南 1819 
    Selecting the Optimum Test Tones and Test Equipment for Successful High-Speed ADC Sinewave Testing
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    53kB
    设计指南 1197 
    How Quantization and Thermal Noise Determine an ADC's Effective Noise Figure
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    289.5kB
    设计指南 729 
    Dynamic Testing of High-Speed ADCs, Part 2
    View   In New Window PDF
    92kB
    设计指南 1040 
    Coherent Sampling vs. Window Sampling
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    92kB
    设计指南 634 
    Pipeline ADCs Come of Age
    View   In New Window PDF
    207.4kB
    设计指南 728 
    Defining and Testing Dynamic Parameters in High-Speed ADCs, Part 1
    View   In New Window PDF
    70kB
    设计指南 1023 
    Understanding Pipelined ADCs
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    72.1kB
    设计指南 989 
    Multiply Your Sampling Rate with Time-Interleaved Data Converters

    高速DAC

    View   In New Window PDF
    780.5kB
    设计指南 5450 
    Successful PCB Grounding with Mixed-Signal Chips - Follow the Path of Least Impedance
    View   In New Window   设计指南 4053 
    解读高速数/模转换器(DAC)的建立和保持时间

    高速信号分配

    View   In New Window PDF
    780.5kB
    设计指南 5450 
    Successful PCB Grounding with Mixed-Signal Chips - Follow the Path of Least Impedance
    View   In New Window   设计指南 872 
    LVDS分离器简化高速信号分配
    View   In New Window   设计指南 1058 
    LVDS实现3G基站的高速信号传送

    无线与RF系统设计

    View   In New Window PDF
    96.3kB
    设计指南 5499 
    Spectrum Inversion in NCDMA to Ensure Compliance with 3GPP2
    View   In New Window PDF
    338.9kB
    设计指南 5429 
    IP3 and Intermodulation Guide
    View   In New Window PDF
    780.5kB
    设计指南 5450 
    Successful PCB Grounding with Mixed-Signal Chips - Follow the Path of Least Impedance
    View   In New Window   设计指南 4636 
    避免ISM-RF产品中的PCB布局“缺陷”
    View   In New Window   设计指南 4651 
    网上研讨会:无线技术指南
    View   In New Window   设计指南 3822 
    利用相位噪声发生器辅助系统测试
    View   In New Window   设计指南 2875 
    噪声系数测量的三种方法
    View   In New Window   设计指南 686 
    QPSK调制器