Maxim > 设计支持 > 技术文档 > 设计指南

设计指南

 应用笔记   设计指南   工程期刊   

请点击目录分类浏览。

高速信号处理

  • ADC
  • DAC
  • 通用产品
  •  
  • 无线

  • View   In New Window PDF
    338.9kB
    设计指南 5429 
    IP3 and Intermodulation Guide
    View   In New Window PDF
    780.5kB
    设计指南 5450 
    Successful PCB Grounding with Mixed-Signal Chips - Follow the Path of Least Impedance
    View   In New Window   设计指南 4681 
    磁共振成像(MRI)
    View   In New Window   设计指南 4696 
    超声成像系统及主要子功能电子元件的设计考虑
    View   In New Window PDF
    91.1kB
    设计指南 4700 
    Introduction to Medical Instruments and Growing Trend for Point-of-Care and Near-Patient Testing
    View   In New Window PDF
    100kB
    设计指南 4682 
    Introduction to Computed Tomography (CT) Medical Imaging
    View   In New Window PDF
    189.9kB
    设计指南 4602 
    Adjusting and Calibrating Out Offset and Gain Error in a Precision DAC
    View   In New Window   设计指南 283 
    高速模数转换器(ADC)的INL/DNL测量
    View   In New Window   设计指南 4038 
    超声接收机VGA输出参考噪声和增益的优化
    View   In New Window PDF
    26kB
    设计指南 2094 
    A Simple ADC Comparison Matrix
    View   In New Window PDF
    289.5kB
    设计指南 729 
    Dynamic Testing of High-Speed ADCs, Part 2
    View   In New Window PDF
    92kB
    设计指南 634 
    Pipeline ADCs Come of Age
    View   In New Window PDF
    207.4kB
    设计指南 728 
    Defining and Testing Dynamic Parameters in High-Speed ADCs, Part 1
    View   In New Window PDF
    72.1kB
    设计指南 989 
    Multiply Your Sampling Rate with Time-Interleaved Data Converters

    ADC

    View   In New Window PDF
    780.5kB
    设计指南 5450 
    Successful PCB Grounding with Mixed-Signal Chips - Follow the Path of Least Impedance
    View   In New Window   设计指南 4681 
    磁共振成像(MRI)
    View   In New Window   设计指南 4696 
    超声成像系统及主要子功能电子元件的设计考虑
    View   In New Window PDF
    91.1kB
    设计指南 4700 
    Introduction to Medical Instruments and Growing Trend for Point-of-Care and Near-Patient Testing
    View   In New Window PDF
    100kB
    设计指南 4682 
    Introduction to Computed Tomography (CT) Medical Imaging
    View   In New Window PDF
    189.9kB
    设计指南 4602 
    Adjusting and Calibrating Out Offset and Gain Error in a Precision DAC
    View   In New Window   设计指南 283 
    高速模数转换器(ADC)的INL/DNL测量
    View   In New Window PDF
    67kB
    设计指南 1819 
    Selecting the Optimum Test Tones and Test Equipment for Successful High-Speed ADC Sinewave Testing
    View   In New Window PDF
    53kB
    设计指南 1197 
    How Quantization and Thermal Noise Determine an ADC's Effective Noise Figure
    View   In New Window PDF
    289.5kB
    设计指南 729 
    Dynamic Testing of High-Speed ADCs, Part 2
    View   In New Window PDF
    159kB
    设计指南 800 
    Design a Low-Jitter Clock for High-Speed Data Converters
    View   In New Window PDF
    92kB
    设计指南 1040 
    Coherent Sampling vs. Window Sampling
    View   In New Window PDF
    92kB
    设计指南 634 
    Pipeline ADCs Come of Age
    View   In New Window PDF
    207.4kB
    设计指南 728 
    Defining and Testing Dynamic Parameters in High-Speed ADCs, Part 1
    View   In New Window PDF
    72.1kB
    设计指南 989 
    Multiply Your Sampling Rate with Time-Interleaved Data Converters

    DAC

    View   In New Window PDF
    780.5kB
    设计指南 5450 
    Successful PCB Grounding with Mixed-Signal Chips - Follow the Path of Least Impedance
    View   In New Window   设计指南 4681 
    磁共振成像(MRI)
    View   In New Window   设计指南 4696 
    超声成像系统及主要子功能电子元件的设计考虑
    View   In New Window PDF
    189.9kB
    设计指南 4602 
    Adjusting and Calibrating Out Offset and Gain Error in a Precision DAC

    通用产品

    View   In New Window PDF
    780.5kB
    设计指南 5450 
    Successful PCB Grounding with Mixed-Signal Chips - Follow the Path of Least Impedance
    View   In New Window PDF
    119kB
    设计指南 2085 
    Histogram Testing Determines DNL and INL Errors
    View   In New Window PDF
    67kB
    设计指南 1819 
    Selecting the Optimum Test Tones and Test Equipment for Successful High-Speed ADC Sinewave Testing
    View   In New Window PDF
    92kB
    设计指南 1040 
    Coherent Sampling vs. Window Sampling
    View   In New Window PDF
    102kB
    设计指南 740 
    Glossary of Frequently Used High-Speed Data Converter Terms

    无线

    View   In New Window PDF
    338.9kB
    设计指南 5429 
    IP3 and Intermodulation Guide
    View   In New Window PDF
    780.5kB
    设计指南 5450 
    Successful PCB Grounding with Mixed-Signal Chips - Follow the Path of Least Impedance