Drypack is a method for packing integrated circuits in a moisture-free environment. The device is baked and immediately sealed in a vacuum-sealed bag.
This process is reserved for package types which are especially susceptible to moisture intrusion. Maxim devices with MSL (Moisture Sensitivity Level) of 2 or higher require drypack. A part-number suffix of -D, +D, or #D at the end of the part number denotes products which ship with drypack. There is no price adder associated with drypacking products with MSL 2 or above.
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