Lead-Free/RoHS Summary

About Lead-Free and RoHS

RoHS (Restriction of Hazardous Substances) is a European Union directive that restricts the use of lead, mercury, cadmium, chromium (VI), PBBs, and PBDEs in electrical and electronic equipment as of July 1, 2006.

Due to environmental concerns, the need for lead-free solutions in electronic components and systems is receiving increasing attention within the semiconductor and electronics industries. Maxim Integrated is committed to working with our customers to be able to offer products which meet their specific needs while complying with RoHS legislation.

Lead is the only RoHS-banned substance of concern for the integrated circuits manufactured by Maxim Integrated, therefore lead-free products are also RoHS compliant products. Like other semiconductor companies, we use tin/lead solder (plating) for the surface finish of leadframes. These packages are deemed as "leaded." Many of our package types are qualified as lead-free and have a surface finish that is comprised of 100% matte tin that has been annealed.

Finding RoHS/Lead-Free Status and Materials Content Data

Use our search tool to find material content data and RoHS complance by part number. The search tool does not provide information for wafer or die products. They are considered RoHS compliant due to the absence of RoHS substances or RoHS exemptions.

Lookup Lead-Free/RoHS Products and Content Data

Lead-Free and RoHS Marking

Maxim has extensive RoHS and materials programs and new parts are being qualified daily. If your part is not yet available in a lead-free version, please contact your local Maxim sales representative or customer service representative to learn when it is scheduled. If you do not know who your customer service rep or sales person is, contact ehs@maximintegrated.com

Examples

    MAX3095EEE-T contains lead
    MAX3095EEE+T is lead-free and RoHS compliant
    MAX3095EEE#T would be RoHS-compliant, but contains lead and is exempt from lead-free requirements.

Additional suffix codes: See Maxim Naming Conventions and the full (PDF) data sheet for the part.

Packages Qualified as Lead-Free

Lead-Free/RoHS Package and Technical Information (including lead-free package marking, packages qualified as lead-free, technical information).

Maxim Standard Packages Qualified for Lead-Free Solder Reflow Profile (Peak Reflow Temp 255 (+5/-0) °C)
 Package   Pin Count 
  6, 28, 68 
12L UDFN 3x3 PPF  12 
14TDFN3x3  14 
aQFN  140 
Au Bump / COF   
BGA  256, 300 
CABGA   
CSBGA  248 
FBGA   
FCBGA   
FCCSP   
FCHIP 
FCLGA  48, 64 
HSBGA  448, 484 
L-FPBGA-OM-LF   
LCCC  10 
LFBGA   
LGA  16 
LGA 3X3 16LD  16 
LPCC  32 
LQFP  32, 48, 52, 64, 100, 120, 128, 144, 176, 208 
LSBGA  484 
MicroDFN  6, 8, 10 
MQFP  44, 80, 100 
ODFN 
PBGA-HS   
PDIP  8, 14, 16, 18, 20, 24, 28, 40 
PLCC  20, 28, 44, 52, 68 
QFN  2, 12, 16, 20, 24, 28, 32, 36, 40, 44, 48, 52, 68 
QSOP  16, 20, 24, 28 
SBGA  484 
SC-70   
SFN 
SOIC  8, 14, 16, 18, 20, 24, 28 
SOT 223 
SOT-143 
SOT-23  3, 4, 5, 6, 8 
SSOP  14, 16, 20, 24, 28, 36 
ST223 
T2 CSP RDL 
TCBGA   
TDFN  2, 6, 8, 10, 14, 28 
TDLGA 
TEBGA  400, 484, 564 
tepbga  448 
TFBGA   
Thin LGA  6, 64, 84 
THIN QFN  8, 12, 16, 20, 24, 28, 32, 36, 38, 40, 42, 44, 48, 56, 68 
THIN QFN (Dual)  6, 8, 10, 14 
THIN QFN Top Exposed Pad  68 
TO92  2, 3 
TQFN  12, 28, 32, 36, 38, 48, 56 
TQFP  32, 44, 48, 64, 80, 100, 144 
TSOC 
TSOP   
TSSOP  8, 14, 16, 20, 24, 28, 38, 48, 56 
TSSOP-Epad  28 
UCSP  4, 6, 8, 9, 12, 16, 20, 25, 30, 36 
UCSP Maxfilm  4, 6, 12, 16, 20, 25, 30 
UCSPR  8, 9 
UFBGA  61 
Ultra Thin LGA   
Ultra-Thin MicroDFN   
uMAX  8, 10 
uSOP 
Uttra-Thin QFN  10, 16, 48 
WLP  4, 6, 8, 9, 12, 15, 16, 20, 24, 25, 28, 30, 32, 36, 40, 42, 45, 46, 48, 49, 56, 58, 60, 63, 67, 70, 81, 100, 110, 132, 144 
WLP HC  9, 24

Plating Thickness

Lead frames for all parts have a plating thickness of 400 to 800 microinches (µ-inch), or 10 to 20 microns.

Backward and Forward Compatibility

Backward and Forward Compatibility