Maxim > EMMI > Lead-Free/RoHS Summary

Lead-Free/RoHS Summary

Maxim has a variety of package types that are qualified as lead-free, to satisfy your environmental ("green") objectives.

About Lead-Free and RoHS

Lead-free (Pb-free) packages offered by Maxim are RoHS compliant. (RoHS compliant means that the part is free of lead, cadmium, chromium, mercury, PBBs and PBDEs. Since none of our processes or parts use or contain cadmium, chromium, mercury, PBBs and PBDEs, lead is the only substance that applies to our parts and therefore, if we designate that a part is lead-free, it is also RoHS compliant.)

Finding RoHS/Lead-Free Status and Materials Content Data

This search does not provide material content data and RoHS compliance status for wafer or die products. They are considered RoHS compliant due to the absence of RoHS substances or RoHS exemptions.

Lead-Free and RoHS Marking

Maxim has extensive RoHS and materials programs and new parts are being qualified daily. If your part is not yet available in a lead-free version, please contact your local Maxim sales representative or customer service representative to learn when it is scheduled. If you do not know who your customer service rep or sales person is, contact
Examples
    MAX3095EEE-T contains lead
    MAX3095EEE+T is lead-free and RoHS compliant
    MAX3095EEE#T would be RoHS-compliant, but contains lead and is exempt from lead-free requirements.
Additional suffix codes: See Maxim Naming Conventions and the full (PDF) data sheet for the part.

Packages Qualified as Lead-Free

Lead-Free/RoHS Package and Technical Information (including lead-free package marking, packages qualified as lead-free, technical information).
Maxim Standard Packages Qualified for Lead-Free Solder Reflow Profile
(Peak Reflow Temp 255 (+5/-0) °C)
 Package   Pin Count 
  6,28,68 
14TDFN3x3  14 
aQFN  140 
Au Bump / COF   
BGA  256,300 
CSBGA  248 
FBGA   
FCBGA   
FCCSP   
FCHIP 
FCLGA  48,64 
HSBGA  448,484 
L-FPBGA-OM-LF   
LCCC  10 
LFBGA   
LGA  16 
LGA 3X3 16LD  16 
LPCC  32 
LQFP  32,48,52,64,100,120,128,144,176,208 
LSBGA  484 
MicroDFN 
MQFP  44,80,100 
MRQ-CU   
ODFN 
PBGA-HS   
PDIP  8,14,16,18,20,24,28,40 
PLCC  20,28,44,52,68 
QFN  12,16,20,24,28,32,36,40,44,48,52,56,68 
QSOP  16,20,24,28 
SBGA  484 
SC-70   
SFN 
SOIC  8,14,16,18,20,24,28 
SOT 223 
SOT-143 
SOT-23  3,4,5,6,8 
SSOP  14,16,20,24,28,36 
ST223 
STK LFBGA   
T2 CSP RDL 
TCBGA   
TDFN  6,8,10,12,14,28 
TDLGA 
TEBGA  400,484,564 
tepbga  448 
TFBGA   
Thin LGA  6,64,84 
THIN QFN  8,12,16,20,24,28,32,36,38,40,42,44,48,56,68 
THIN QFN (Dual)  6,8,10,14 
THIN QFN Top Exposed Pad  68 
TO92  2,3 
TQFN  12,28,32,36,38,48,56 
TQFP  32,44,48,64,80,100,144 
TSOC 
TSOP   
TSSOP  8,14,16,20,24,28,38,48,56 
TSSOP-Epad  28 
UCSP  4,6,8,9,12,16,20,25,30,36 
UCSP Maxfilm  4,6,12,16,20,25,30 
UCSPR  8,9 
uDFN  10,12 
UFBGA  61 
Ultra Thin LGA   
Ultra-Thin MicroDFN   
uMAX  8,10 
Uttra-Thin QFN  10,16,48 
WLP  4,6,8,9,12,15,16,20,24,25,28,30,32,36,40,42,45,46,48,49,56,58,60,63,67,70,81,100,110,132,144 
WLP HC  9,24 

Lead and Lead-Free Solder Usage

Environmental Materials Management

Peak Reflow

To check a single part number, enter the part number and click Search. You can enter the full, orderable part number, including prefix and suffix letters, such as MAX232CPE or partial numbers like MAX232.

Plating Thickness

Lead frames for all parts have a plating thickness of 400 to 800 microinches (µ-inch), or 10 to 20 microns.

Backward and Forward Compatibility