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Lookup Lead-Free/RoHS Products and Content Data

Product Content Information for MAX6250AMJA

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Qualifications
Package Description
Chemical Composition Summary
Detailed Package Component Data
 
Qualifications  Top
Lead-Free Qualified No
REACH Yes: 2014-06-16
RoHS Qualified No
Green No
Moisture Sensitivity Level L1
Flammability Meets UL-94 (V-0 Rating) No
 
Package Description  Top
Package Code J8-2
Package Type CDIP(N) *
Package Description Ceramic Dual-In-Line, Narrow (0.3in)
Package Option
Footprint Area (mm2) 82.6
Body Size .300"
Pin Count 8
Lead Form1 TH
Unit Weight in Grams 1.0796241
 
Chemical Composition Summary  Top
Maxim NIA/NIU Substance List (PDF, 24k)
Substance CAS Number Amount
(grams)
% of
Unit Weight
Aluminum (Al) 7429-90-5 0 0
Antimony (Sb2O3) 1309-64-4 0 0
BCB Resin 0 0
Bromine (Br) 7726-95-6 0 0
Carbon (C) 7440-44-0 7.3e-05 0.00676
Carbon Black 1333-86-4 0 0
Ceramic (BaTiO3) 12047-27-7 0 0
Chromium (Cr) 7440-47-3 0 0
Cobalt (Co) 7440-48-4 0.00073 0.06762
Copper (Cu) 7440-50-8 0 0
Gold (Au) 7440-57-5 0 0
Indium (In) 7440-74-6 0 0
Insulator (Polyimide) 0 0
Insulator Film 0 0
Iron (Fe) 7439-89-6 0.0813 7.53040
FeO2 12411-15-36 0 0
Lead (Pb) 7439-92-1 0.011 1.01887
Magnesium (Mg) 7439-95-4 0 0
Manganese (Mn) 7439-96-5 0.00115 0.10652
MnO3 0 0
Nickel (Ni) 7440-02-0 0.0591 5.47413
NiPdAu 0 0
Nickel-V (NiV) 0 0
Palladium (Pd) 7440-05-3 0 0
Phosphorus (P) 7723-14-0 0 0
Silica (SiO2) 11126-22-0 0 0
Silicon (Si) 7440-21-3 0.00385 0.35661
Silver (Ag) 7440-22-4 0.00015 0.01389
Solder Mask 0 0
Solder Paste 0 0
Spheron Polymer Passivation 0 0
Sulfur (S) 7704-34-9 0 0
Tin (Sn) 7440-31-5 0.0091 0.84289
Titanium (Ti) 7440-32-6 0 0
Titanium-W (TiW) 0 0
Tungsten (W) 7440-33-7 0 0
Vanadium (V) 7440-62-2 0 0
Zinc (Zn) 7440-66-6 0 0
ZnO 1314-13-2 0 0
Zirconium (Zr) 7440-67-7 0 0
 
Detailed Package Component Data  Top
Base/Lid Components
Summary
Base Material Alumina (Al2O3) Black
Lid/Cap Material Alumina (Al2O3) Black
Component Weight 0.913
Substance Amount
(grams)
% of
Component Weight
% of
Unit Weight
Base Weight 0.5478 60.00000 50.73988
Lid Weight 0.3652 40.00000 33.82659
 
Bond Wire Components
Summary
Component Weight 0.00015
Substance Amount
(grams)
% of
Component Weight
% of
Unit Weight
Gold (Au) 0 0 0
Aluminum (Al) 0.00015 100.00000 0.01389
 
Die Attach Epoxy Components
Summary
Die Attach Material QMI2419MA
Component Weight 0.0001711
Substance Amount
(grams)
% of
Component Weight
% of
Unit Weight
Aromatic Amine 0 0 0
Copper (Cu) 0 0 0
Diester 0 0 0
Epoxy 2.11e-05 12.33197 0.00195
Functionalized Ester 0 0 0
Functionalized Urethane 0 0 0
Indium (In) 0 0 0
Lactone 0 0 0
Lead (Pb) 0 0 0
Polymeric 0 0 0
Polyoxypropylenediamine 0 0 0
Resin 0 0 0
Silver Filler (Ag) 0.00015 87.66803 0.01389
Tin (Sn) 0 0 0
Other 0 0 0
 
Lead Finish/Plating Components
Summary
Lead Finish Plating 63Sn/37Pb
Assembly Lead Finish Process Solder Dip
Component Weight 0.0201
Substance Amount
(grams)
% of
Component Weight
% of
Unit Weight
Lead (Pb) 0.011 54.72637 1.01887
Tin (Sn) 0.0091 45.27363 0.84289
NiPdAu 0 0 0
Gold (Au) 0 0 0
Nickel (Ni) 0 0 0
 
Lead Frame Components
Summary
Lead Frame Material Alloy 42
Component Weight 0.142763
Substance Amount
(grams)
% of
Component Weight
% of
Unit Weight
Aluminum (Al) 0 0 0
Carbon (C) 7.3e-05 0.05113 0.00676
Chromium (Cr) 0 0 0
Cobalt (Co) 0.00073 0.51134 0.06762
Copper (Cu) 0 0 0
Gold (Au) 0 0 0
Iron (Fe) 0.0813 56.94753 7.53040
Lead (Pb) 0 0 0
Magnesium (Mg) 0 0 0
Manganese (Mn) 0.00115 0.80553 0.10652
Nickel (Ni) 0.0591 41.39728 5.47413
Palladium (Pd) 0 0 0
Phosphorus (P) 0 0 0
Silicon (Si) 0.00041 0.28719 0.03798
Silver (Ag) 0 0 0
Sulfur (S) 0 0 0
Tin (Sn) 0 0 0
Zinc (Zn) 0 0 0
Zirconium (Zr) 0 0 0
 
Silicon Chip Components
Substance Amount
(grams)
% of
Component Weight
% of
Unit Weight
Silicon Chip 0.00344 100 0.31863
 

Notes:

1. Lead Form: GW - Gull Wing, TH - Through Hole.
2. Refer to product data sheet to confirm actual wire diameter.
3. 'ND' means None Detected, negligible amount present.
* This package may be remarked. If remarked, the package will contain additional homogeneous materials—inks—that are not listed in contents of this report.

This part is not qualified as lead-free.
Parts not currently qualified as lead-free may not have been qualified as such due to low demand. Also, some packages types cannot be produced as lead-free for technical reasons. If a customer requires that a package type "not qualified" as lead-free be manufactured and supplied, a request must be submitted to your Maxim sales contact person for approval. The navigation bar on the EMMI website contains information regarding the lead-free process (e.g. MSL's, Peak reflow Temperatures, JEDEC methods, frequently asked questions and answers, lead-free package tables, and status/qualification plans for particular package types qualified as lead-free or in the qualification process).

See a list of packages qualified as lead-free.

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