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Lookup Lead-Free/RoHS Products and Content Data

Product Content Information for MAX6250AESA-T

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Qualifications
Package Description
Chemical Composition Summary
Detailed Package Component Data
 
Qualifications  Top
Lead-Free Qualified No
REACH Yes: 2014-06-16
RoHS Qualified No
Green No
Moisture Sensitivity Level L1
Flammability Meets UL-94 (V-0 Rating) Yes
Assembler Qualified ATP 
 
Package Description  Top
Package Code S8-5
Package Type SOIC(N) *
Package Description Small-Outline IC, Narrow (0.15in)
Package Option Standard
Footprint Area (mm2) 30.9
Body Size .150"
Pin Count 8
Lead Form1 GW
Unit Weight in Grams 0.078046
 
Chemical Composition Summary  Top
Maxim NIA/NIU Substance List (PDF, 24k)
Substance CAS Number Amount
(grams)
% of
Unit Weight
Aluminum (Al) 7429-90-5 0 0
Antimony (Sb2O3) 1309-64-4 0.00128 1.64006
BCB Resin 0 0
Bromine (Br) 7726-95-6 0.00043 0.55096
Carbon (C) 7440-44-0 0 0
Carbon Black 1333-86-4 0 0
Ceramic (BaTiO3) 12047-27-7 0 0
Chromium (Cr) 7440-47-3 0 0
Cobalt (Co) 7440-48-4 0 0
Copper (Cu) 7440-50-8 0.0289 37.02944
Gold (Au) 7440-57-5 0.000156 0.19988
Indium (In) 7440-74-6 0 0
Insulator (Polyimide) 0 0
Insulator Film 0 0
Iron (Fe) 7439-89-6 0.0007 0.89691
FeO2 12411-15-36 0 0
Lead (Pb) 7439-92-1 0.0003 0.38439
Magnesium (Mg) 7439-95-4 0 0
Manganese (Mn) 7439-96-5 0 0
MnO3 0 0
Nickel (Ni) 7440-02-0 0 0
NiPdAu 0 0
Nickel-V (NiV) 0 0
Palladium (Pd) 7440-05-3 0 0
Phosphorus (P) 7723-14-0 0 0
Silica (SiO2) 11126-22-0 0.0307 39.33578
Silicon (Si) 7440-21-3 0.0031 3.97202
Silver (Ag) 7440-22-4 0.00048 0.61502
Solder Mask 0 0
Solder Paste 0 0
Spheron Polymer Passivation 0 0
Sulfur (S) 7704-34-9 0 0
Tin (Sn) 7440-31-5 0.00167 2.13976
Titanium (Ti) 7440-32-6 0 0
Titanium-W (TiW) 0 0
Tungsten (W) 7440-33-7 0 0
Vanadium (V) 7440-62-2 0 0
Zinc (Zn) 7440-66-6 3e-05 0.03844
ZnO 1314-13-2 0 0
Zirconium (Zr) 7440-67-7 0 0
 
Detailed Package Component Data  Top
Bond Wire Components
Summary
Component Weight 0.000156
Substance Amount
(grams)
% of
Component Weight
% of
Unit Weight
Gold (Au) 0.000156 100.00000 0.19988
Aluminum (Al) 0 0 0
 
Die Attach Epoxy Components
Summary
Die Attach Material 84-1LMISR4
Component Weight 0.00058
Substance Amount
(grams)
% of
Component Weight
% of
Unit Weight
Aromatic Amine 0 0
Copper (Cu) 0 0 0
Diester 0 0 0
Epoxy 0.0001 17.24138 0.12813
Functionalized Ester 0 0 0
Functionalized Urethane 0 0 0
Indium (In) 0 0 0
Lactone 0 0 0
Lead (Pb) 0 0 0
Polymeric 0 0 0
Polyoxypropylenediamine 0 0 0
Resin 0 0 0
Silver Filler (Ag) 0.00048 82.75862 0.61502
Tin (Sn) 0 0 0
Other 0 0
 
Lead Finish/Plating Components
Summary
Lead Finish Plating 85Sn/15Pb plate
Assembly Lead Finish Process
Component Weight 0.00197
Substance Amount
(grams)
% of
Component Weight
% of
Unit Weight
Lead (Pb) 0.0003 15.22843 0.38439
Tin (Sn) 0.00167 84.77157 2.13976
NiPdAu 0 0 0
Gold (Au) 0 0 0
Nickel (Ni) 0 0 0
 
Lead Frame Components
Summary
Lead Frame Material Copper C194
Component Weight 0.02963
Substance Amount
(grams)
% of
Component Weight
% of
Unit Weight
Aluminum (Al) 0 0 0
Carbon (C) 0 0 0
Chromium (Cr) 0 0 0
Cobalt (Co) 0 0
Copper (Cu) 0.0289 97.53628 37.02944
Gold (Au) 0 0
Iron (Fe) 0.0007 2.36247 0.89691
Lead (Pb) 0 0
Magnesium (Mg) ND 0 0
Manganese (Mn) 0 0
Nickel (Ni) ND 0 0
Palladium (Pd) 0 0 0
Phosphorus (P) 0 0
Silicon (Si) 0 0
Silver (Ag) 0 0
Sulfur (S) 0 0 0
Tin (Sn) 0 0
Zinc (Zn) 3e-05 0.10125 0.03844
Zirconium (Zr) 0 0 0
 
Mold Compound Components
Summary
Mold Material Sumitomo 6600CS
Resin Type OCN
Component Weight 0.04261
Substance Amount
(grams)
% of
Component Weight
% of
Unit Weight
Antimony (Sb2O3) 0.00128 3.00399 1.64006
Bromine (Br) 0.00043 1.00915 0.55096
Carbon Black 0 0
Epoxy 0 0 0
Epoxy Cresol Novolac 0 0 0
Metal Hydroxide 0 0
Phenol Novolac 0 0
Silica (SiO2) 0.0307 72.04881 39.33578
Resin 0.0102 23.93804 13.06922
Other 0 0
 
Silicon Chip Components
Substance Amount
(grams)
% of
Component Weight
% of
Unit Weight
Silicon Chip 0.0031 100 3.97202
 

Notes:

1. Lead Form: GW - Gull Wing, TH - Through Hole.
2. Refer to product data sheet to confirm actual wire diameter.
3. 'ND' means None Detected, negligible amount present.
* This package may be remarked. If remarked, the package will contain additional homogeneous materials—inks—that are not listed in contents of this report.

This part is not qualified as lead-free.
Parts not currently qualified as lead-free may not have been qualified as such due to low demand. Also, some packages types cannot be produced as lead-free for technical reasons. If a customer requires that a package type "not qualified" as lead-free be manufactured and supplied, a request must be submitted to your Maxim sales contact person for approval. The navigation bar on the EMMI website contains information regarding the lead-free process (e.g. MSL's, Peak reflow Temperatures, JEDEC methods, frequently asked questions and answers, lead-free package tables, and status/qualification plans for particular package types qualified as lead-free or in the qualification process).

See a list of packages qualified as lead-free.

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