MAX13235EEVKIT

Evaluation Kit for the MAX13234E and MAX13235E

 Overview   Design Resources   Ordering Info   Related Products   All   

Status Explanations for product status codes

Active: In Production.

Description

The MAX13235E evaluation kit (EV kit) provides a proven design to evaluate the MAX13235E, a 3Mbps RS-232 transceiver with low-voltage interface and enhanced electrostatic discharge (ESD) protection. This EV kit demonstrates the MAX13235E in a 20-pin TSSOP package. The MAX13235E is also available in a 20-pin TQFN package with an exposed pad, but that package is not compatible with this EV kit.

The MAX13235E EV kit PCB comes with a MAX13235EEUP+ installed, which is the 3Mbps data-rate version. The MAX13235E EV kit can also be used to evaluate the MAX13234E (250kbps data-rate version). Contact the factory for free samples of the pin-compatible MAX13234EEUP+ to evaluate this device.

Data Sheet

Download this datasheet in PDF formatDownload Rev 0 (PDF, 160kB)
Send this datasheet to any email addressEmail

My Maxim: Not Logged In
By logging in to My Maxim you can subscribe to alerts for this data sheet.

Login | Register
NOTE: This product uses the following:
MAX13235E EVKIT Software

Key Features

  • 3V to 5.5V Single-Supply Operation
  • 3Mbps RS-232 Data Rate
  • Low-Voltage Logic Interface
  • Digital Loopbacks
  • RS-232 Loopbacks
  • Lead(Pb)-Free and RoHS Compliant
  • Proven PCB Layout
  • Fully Assembled and Tested
   
   

Didn't Find What You Need?

Information Index

Overview

 

Design Resources

 

Ordering Info

 

Related Products

 
Description
Key Features
Applications/Uses
Key Specifications
Diagram
Notes and Comments
  Data Sheet
Technical Documents
Evaluation Kits
Reliability Reports
Software/Models
  Price and Availability
Samples
Buy Online
Package Information
Lead-Free Information
  Similar Products by Function
Similar Products by Application
Evaluation Kits
Products with Similar Part Numbers
Products Used With This
 
Document Ref.: 19-4545 Rev 0; 2009-06-26
This page last modified: 2009-06-26