Maxim at a Glance
At Maxim, we invent highly integrated solutions that make technology seamless. We channel our collective expertise to stretch the limits of technology, understand your needs, and help you get to market faster.
$2.4 billion (approx.) revenue in FY2013
$585 million revenue in Q1 FY2014
$3.76 billion in assets in Q1 FY2014
$1.03 billion in cash in Q1 FY2014
President and CEO
San Jose, CA, U.S.
1983. We celebrate our 30th anniversary in 2013.
Keywords: smart card, smart card interface, Teridian, NXP Related Parts
APPLICATION NOTE 4859
Teridian 73S8024RN versus NXP TDA8024T
Dec 16, 2010
Abstract: This application note highlights the advantages of the Teridian 73S8024RN smart-card interface compared with the NXP® Semiconductors TDA8024T. The Teridian 73S8024RN can easily replace a TDA8024T in most the existing applications. After considering the topics discussed in this document, the 73S8024RN in a 28-pin SO functions similarly to the TDA8024T and is a direct drop-in replacement for that NXP part. This discussion will help ensure the successful replacement. The article will also explain some technical differences that can marginally affect the behavior of the application with the 71S8024RN.
The 73S8024RN is also packaged in a 32-pin QFN (5mm x 5mm) and 20-pin QFN (4mm x 4mm). In these packages the IC significantly reduces the physical area required in space-limited PCB applications. Note that the pin numbers mentioned in this document refer to the 29-pin SO package.
The document you have requested is available in Acrobat PDF format: